AMD Xilinx
XC3120A-09PQ100C
XC3120A-09PQ100C ECAD Model
XC3120A-09PQ100C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 64 | |
| Number of Outputs | 64 | |
| Number of Logic Cells | 64 | |
| Number of Equivalent Gates | 1000 | |
| Number of CLBs | 64 | |
| Combinatorial Delay of a CLB-Max | 1.5 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | RECTANGULAR | |
| Technology | CMOS | |
| Organization | 64 CLBS, 1000 GATES | |
| Additional Feature | MAX USABLE 1500 LOGIC GATES | |
| Clock Frequency-Max | 370 MHz | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.25 V | |
| Supply Voltage-Min | 4.75 V | |
| JESD-30 Code | R-PQFP-G100 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 100 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | QFP | |
| Package Equivalence Code | QFP100,.7X.9 | |
| Package Shape | RECTANGULAR | |
| Package Style | FLATPACK | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 650 µm | |
| Terminal Position | QUAD | |
| Width | 14 mm | |
| Length | 20 mm | |
| Seated Height-Max | 3.4 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | QFP, QFP100,.7X.9 | |
| Pin Count | 100 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC3120A-09PQ100C Datasheet Download
XC3120A-09PQ100C Overview
The XC3120A-09PQ100C chip model is a powerful tool for high-performance digital signal processing, embedded processing, and image processing. It is designed to be used with the HDL language, which allows for the development of complex systems. As the chip model is currently being used in various industries, its potential use in the future is worth exploring.
As the technology industry evolves, the XC3120A-09PQ100C chip model is likely to become even more useful. It is possible that new technologies will be needed to support the application environment, allowing for more efficient and powerful processing. In addition, the chip model may be used in networks and intelligent scenarios, such as in the era of fully intelligent systems. This could open up new possibilities for the chip model, allowing it to be used in a variety of different contexts.
In the future, the XC3120A-09PQ100C chip model may be used to create powerful and efficient systems that can be used in a variety of different environments. It could be used to create systems that are capable of handling large amounts of data, or to create systems that are able to process and analyze data quickly and accurately. It could also be used to create systems that are able to interact with people in a natural and intuitive way.
As the technology industry continues to evolve, the XC3120A-09PQ100C chip model is likely to become even more useful. It is possible that new technologies will be needed to support the application environment, allowing for more efficient and powerful processing. In addition, the chip model may be used in networks and intelligent scenarios, such as in the era of fully intelligent systems. This could open up new possibilities for the chip model, allowing it to be used in a variety of different contexts.
The XC3120A-09PQ100C chip model is an incredibly powerful tool for digital signal processing, embedded processing, and image processing. It is versatile enough to be used in a variety of different contexts, and is capable of handling large amounts of data quickly and accurately. As the technology industry continues to evolve, the XC3120A-09PQ100C chip model is likely to become even more useful. It is possible that new technologies will be needed to support the application environment, allowing for more efficient and powerful processing. In addition, the chip model may be used in networks and intelligent scenarios, such as in the era of fully intelligent systems. This could open up new possibilities for the chip model, allowing it to be used in a variety of different contexts.
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| QTY | Unit Price | Ext Price |
|---|---|---|
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