AMD Xilinx
XC3120-5PQ100I
XC3120-5PQ100I ECAD Model
XC3120-5PQ100I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 64 | |
| Number of Outputs | 64 | |
| Number of Logic Cells | 64 | |
| Number of Equivalent Gates | 1000 | |
| Number of CLBs | 64 | |
| Combinatorial Delay of a CLB-Max | 4.1 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | RECTANGULAR | |
| Technology | CMOS | |
| Organization | 64 CLBS, 1000 GATES | |
| Additional Feature | TYP. GATES = 1000-1500 | |
| Clock Frequency-Max | 188 MHz | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.5 V | |
| Supply Voltage-Min | 4.5 V | |
| JESD-30 Code | R-PQFP-G100 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 100 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | QFP | |
| Package Equivalence Code | QFP100,.7X.9 | |
| Package Shape | RECTANGULAR | |
| Package Style | FLATPACK | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 650 µm | |
| Terminal Position | QUAD | |
| Width | 14 mm | |
| Length | 20 mm | |
| Seated Height-Max | 3.4 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | QFP, QFP100,.7X.9 | |
| Pin Count | 100 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC3120-5PQ100I Datasheet Download
XC3120-5PQ100I Overview
The XC3120-5PQ100I chip model is a powerful and versatile digital signal processor (DSP) designed for high-performance embedded processing, image processing, and other digital signal processing tasks. It is programmed using the hardware description language (HDL) and is capable of high-speed operation, making it an ideal choice for many applications.
The chip model is well-suited for use in industrial, medical, and consumer electronics applications, as well as for use in communications and networking applications. It can be used for a wide range of tasks, from signal processing and image processing to embedded computing and communications.
The chip model has the potential to be used in a wide range of applications and scenarios, from high-speed control systems to embedded systems, from communications systems to image processing. It is also suitable for use in networked systems, as it is capable of handling large amounts of data quickly and efficiently.
In the era of fully intelligent systems, the chip model is likely to be used in a variety of intelligent scenarios. It can be used for facial recognition, object recognition, natural language processing, and other forms of artificial intelligence. It can also be used for autonomous navigation and control, as well as for robotics and autonomous vehicles.
The chip model is also likely to be used in the future for a variety of networked applications, such as wireless networks, mesh networks, and the Internet of Things (IoT). It is also likely to be used in the future for a variety of intelligent applications, such as autonomous vehicles and robots, as well as for autonomous navigation and control.
The chip model is likely to be used in a variety of applications and scenarios in the future, as new technologies and applications are developed and implemented. The chip model is capable of high-speed operation and is well-suited for use in a variety of applications and scenarios, making it a valuable and versatile tool for the future.
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| QTY | Unit Price | Ext Price |
|---|---|---|
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