AMD Xilinx
XC3120-5PC68C
XC3120-5PC68C ECAD Model
XC3120-5PC68C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 58 | |
| Number of Outputs | 58 | |
| Number of Logic Cells | 64 | |
| Number of Equivalent Gates | 1000 | |
| Number of CLBs | 64 | |
| Combinatorial Delay of a CLB-Max | 4.1 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | COMMERCIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 64 CLBS, 1000 GATES | |
| Additional Feature | TYP. GATES = 1000-1500 | |
| Clock Frequency-Max | 188 MHz | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.25 V | |
| Supply Voltage-Min | 4.75 V | |
| JESD-30 Code | S-PQCC-J68 | |
| Qualification Status | Not Qualified | |
| Moisture Sensitivity Level | 1 | |
| Operating Temperature-Max | 70 °C | |
| Number of Terminals | 68 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | QCCJ | |
| Package Equivalence Code | LDCC68,1.0SQ | |
| Package Shape | SQUARE | |
| Package Style | CHIP CARRIER | |
| Surface Mount | YES | |
| Terminal Form | J BEND | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | QUAD | |
| Width | 24.2316 mm | |
| Length | 24.2316 mm | |
| Seated Height-Max | 5.08 mm | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | QCCJ, LDCC68,1.0SQ | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 | |
| Part Package Code | LCC | |
| Pin Count | 68 |
XC3120-5PC68C Datasheet Download
XC3120-5PC68C Overview
The XC3120-5PC68C chip model is a powerful digital signal processor (DSP) designed for high-performance embedded applications such as digital signal processing, embedded processing, and image processing. It is a scalable, low-power DSP that supports a wide range of applications and can be programmed using the HDL language.
The XC3120-5PC68C chip model offers many advantages, such as a high-performance 32-bit RISC processor core, a rich set of on-chip peripherals, and a wide range of memory and I/O options. It also supports a variety of operating systems, including Linux, Windows, and Android. Furthermore, it is highly configurable and can be used in a wide range of applications.
The XC3120-5PC68C chip model is expected to be in high demand in the future, as it is well-suited for a variety of applications. It is expected to be used in a variety of industries, such as automotive, medical, industrial, and consumer electronics. In addition, it is expected to be used in a variety of applications, such as machine vision, robotics, and artificial intelligence.
The application environment of the XC3120-5PC68C chip model may require the support of new technologies, such as artificial intelligence and machine learning. As these technologies become more widely adopted, the XC3120-5PC68C chip model is expected to be in high demand in the future.
In conclusion, the XC3120-5PC68C chip model is a powerful and versatile DSP that is well-suited for a variety of high-performance embedded applications. It is expected to be in high demand in the future, as it is well-suited for a variety of applications and may require the support of new technologies. It is a scalable and low-power DSP that offers many advantages and can be programmed using the HDL language.
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| QTY | Unit Price | Ext Price |
|---|---|---|
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