AMD Xilinx
XC3120-4PQ100I
XC3120-4PQ100I ECAD Model
XC3120-4PQ100I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 64 | |
| Number of Outputs | 64 | |
| Number of Logic Cells | 64 | |
| Number of Equivalent Gates | 1000 | |
| Number of CLBs | 64 | |
| Combinatorial Delay of a CLB-Max | 3.3 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | RECTANGULAR | |
| Technology | CMOS | |
| Organization | 64 CLBS, 1000 GATES | |
| Additional Feature | TYP. GATES = 1000-1500 | |
| Clock Frequency-Max | 227 MHz | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.5 V | |
| Supply Voltage-Min | 4.5 V | |
| JESD-30 Code | R-PQFP-G100 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 100 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | QFP | |
| Package Equivalence Code | QFP100,.7X.9 | |
| Package Shape | RECTANGULAR | |
| Package Style | FLATPACK | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 650 µm | |
| Terminal Position | QUAD | |
| Width | 14 mm | |
| Length | 20 mm | |
| Seated Height-Max | 3.4 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | QFP, QFP100,.7X.9 | |
| Pin Count | 100 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC3120-4PQ100I Datasheet Download
XC3120-4PQ100I Overview
The XC3120-4PQ100I chip model is a powerful and versatile tool for digital signal processing, embedded processing, and image processing. It is designed to be used with the HDL language, making it a great choice for applications that require high-performance processing. With its robust design and advanced features, the XC3120-4PQ100I chip model is well-suited for a wide variety of applications.
The XC3120-4PQ100I chip model has many advantages over its competitors. It is capable of handling large amounts of data quickly and efficiently, and its versatile design allows it to be used in a variety of different applications. Additionally, the chip model is highly reliable and has a low power consumption, making it ideal for use in low-power applications. Furthermore, the chip model is cost-effective and can be easily integrated into existing systems.
The demand for the XC3120-4PQ100I chip model is expected to grow in the future, as more applications require high-performance processing. In particular, the chip model is well-suited for the development of intelligent robots, as its powerful processing capabilities can be used to control complex robotic systems. To use the XC3120-4PQ100I chip model effectively, engineers and developers must have a deep understanding of HDL language and be familiar with the chip model's features and capabilities. Additionally, they must be able to design and implement efficient algorithms to control robotic systems. With the right technical skills, the XC3120-4PQ100I chip model can be used to develop and popularize future intelligent robots.
You May Also Be Interested In
5,923 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||