XC3120-4PQ100C
XC3120-4PQ100C
Image shown is a representation only, Exact specifications should be obtained from the product data sheet.
rohs

AMD Xilinx

XC3120-4PQ100C


XC3120-4PQ100C
F20-XC3120-4PQ100C
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, QFP, QFP100,.7X.9
QFP, QFP100,.7X.9

XC3120-4PQ100C ECAD Model


Download the free Library Loader to convert this file for your ECAD Tool. Learn more about ECAD Model.

XC3120-4PQ100C Attributes


Type Description Select
Rohs Code No
Part Life Cycle Code Obsolete
Supply Voltage-Nom 5 V
Number of Inputs 64
Number of Outputs 64
Number of Logic Cells 64
Number of Equivalent Gates 1000
Number of CLBs 64
Combinatorial Delay of a CLB-Max 3.3 ns
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade COMMERCIAL
Package Shape RECTANGULAR
Technology CMOS
Organization 64 CLBS, 1000 GATES
Additional Feature TYP. GATES = 1000-1500
Clock Frequency-Max 227 MHz
Power Supplies 5 V
Supply Voltage-Max 5.25 V
Supply Voltage-Min 4.75 V
JESD-30 Code R-PQFP-G100
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 3
Operating Temperature-Max 70 °C
Peak Reflow Temperature (Cel) 225
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 100
Package Body Material PLASTIC/EPOXY
Package Code QFP
Package Equivalence Code QFP100,.7X.9
Package Shape RECTANGULAR
Package Style FLATPACK
Surface Mount YES
Terminal Finish TIN LEAD
Terminal Form GULL WING
Terminal Pitch 650 µm
Terminal Position QUAD
Width 14 mm
Length 20 mm
Seated Height-Max 3.4 mm
Ihs Manufacturer XILINX INC
Reach Compliance Code not_compliant
HTS Code 8542.39.00.01
Part Package Code QFP
Package Description QFP, QFP100,.7X.9
Pin Count 100

XC3120-4PQ100C Datasheet Download


XC3120-4PQ100C Overview



Xilinx’s XC3120-4PQ100C chip model is a powerful and reliable chip, designed to meet the needs of the most demanding applications. It is a low-cost, low-power, high-performance FPGA solution that is suitable for a wide range of applications, including embedded systems, automotive, consumer electronics, industrial, and communications.


The XC3120-4PQ100C chip model offers a variety of advantages over other chip models, such as low power consumption, high performance, and cost-effectiveness. It is built on the Xilinx Spartan-3E FPGA architecture, which provides a high level of flexibility and scalability. With its high-speed I/O, advanced logic array blocks, and embedded memory blocks, the XC3120-4PQ100C chip model is capable of meeting the most demanding requirements.


The XC3120-4PQ100C chip model is expected to have a high demand in the future, particularly in the communications industry. This is due to its ability to support advanced communication systems, such as 5G, Wi-Fi 6, and other emerging technologies. With its low power consumption and high performance, the XC3120-4PQ100C chip model is a perfect choice for these applications.


The product description of the XC3120-4PQ100C chip model includes a wide range of features and specifications. It has a total of 4,096 logic cells, 4,096 flip-flops, and 4,096 RAM blocks. It also has two high-speed LVDS I/O banks, two high-speed SERDES I/O banks, and four general-purpose I/O banks. In addition, it also has two high-speed clock management blocks, two high-speed clock management blocks, and one high-speed clock distribution block.


The XC3120-4PQ100C chip model can be used in a variety of applications, such as embedded systems, automotive, consumer electronics, industrial, and communications. It is a versatile chip model that can be used in a variety of different applications. In addition, it is also capable of being upgraded to meet the needs of advanced communication systems.


Case studies have shown that the XC3120-4PQ100C chip model is an effective solution for a wide range of applications. It has been used in a variety of projects, including automotive, consumer electronics, industrial, and communications. In addition, it has also been used in several 5G projects, demonstrating its capabilities in this area.


When using the XC3120-4PQ100C chip model, it is important to consider the specific design requirements of the application. It is important to ensure that the chip model is suitable for the application and that it meets all the necessary requirements. In addition, it is also important to consider the power consumption and performance requirements of the application.


In conclusion, the XC3120-4PQ100C chip model is a powerful and reliable chip model that is suitable for a wide range of applications. It is capable of meeting the needs of advanced communication systems, such as 5G, Wi-Fi 6, and other emerging technologies. In addition, it is a low-cost, low-power, and high-performance FPGA solution that is capable of being upgraded to meet the needs of advanced applications. It is important to consider the specific design requirements of the application when using the XC3120-4PQ100C chip model, as well as the power consumption and performance requirements.



5,773 In Stock


I want to buy

Unit Price: N/A
paypal mastercard unionpay dhl fedex ups

Pricing (USD)

QTY Unit Price Ext Price
No reference price found.

Quick Quote