
AMD Xilinx
XC3120-4PQ100C
XC3120-4PQ100C ECAD Model
XC3120-4PQ100C Attributes
Type | Description | Select |
---|---|---|
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 5 V | |
Number of Inputs | 64 | |
Number of Outputs | 64 | |
Number of Logic Cells | 64 | |
Number of Equivalent Gates | 1000 | |
Number of CLBs | 64 | |
Combinatorial Delay of a CLB-Max | 3.3 ns | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | COMMERCIAL | |
Package Shape | RECTANGULAR | |
Technology | CMOS | |
Organization | 64 CLBS, 1000 GATES | |
Additional Feature | TYP. GATES = 1000-1500 | |
Clock Frequency-Max | 227 MHz | |
Power Supplies | 5 V | |
Supply Voltage-Max | 5.25 V | |
Supply Voltage-Min | 4.75 V | |
JESD-30 Code | R-PQFP-G100 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 70 °C | |
Peak Reflow Temperature (Cel) | 225 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 100 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | QFP | |
Package Equivalence Code | QFP100,.7X.9 | |
Package Shape | RECTANGULAR | |
Package Style | FLATPACK | |
Surface Mount | YES | |
Terminal Finish | TIN LEAD | |
Terminal Form | GULL WING | |
Terminal Pitch | 650 µm | |
Terminal Position | QUAD | |
Width | 14 mm | |
Length | 20 mm | |
Seated Height-Max | 3.4 mm | |
Ihs Manufacturer | XILINX INC | |
Reach Compliance Code | not_compliant | |
HTS Code | 8542.39.00.01 | |
Part Package Code | QFP | |
Package Description | QFP, QFP100,.7X.9 | |
Pin Count | 100 |
XC3120-4PQ100C Datasheet Download
XC3120-4PQ100C Overview
Xilinx’s XC3120-4PQ100C chip model is a powerful and reliable chip, designed to meet the needs of the most demanding applications. It is a low-cost, low-power, high-performance FPGA solution that is suitable for a wide range of applications, including embedded systems, automotive, consumer electronics, industrial, and communications.
The XC3120-4PQ100C chip model offers a variety of advantages over other chip models, such as low power consumption, high performance, and cost-effectiveness. It is built on the Xilinx Spartan-3E FPGA architecture, which provides a high level of flexibility and scalability. With its high-speed I/O, advanced logic array blocks, and embedded memory blocks, the XC3120-4PQ100C chip model is capable of meeting the most demanding requirements.
The XC3120-4PQ100C chip model is expected to have a high demand in the future, particularly in the communications industry. This is due to its ability to support advanced communication systems, such as 5G, Wi-Fi 6, and other emerging technologies. With its low power consumption and high performance, the XC3120-4PQ100C chip model is a perfect choice for these applications.
The product description of the XC3120-4PQ100C chip model includes a wide range of features and specifications. It has a total of 4,096 logic cells, 4,096 flip-flops, and 4,096 RAM blocks. It also has two high-speed LVDS I/O banks, two high-speed SERDES I/O banks, and four general-purpose I/O banks. In addition, it also has two high-speed clock management blocks, two high-speed clock management blocks, and one high-speed clock distribution block.
The XC3120-4PQ100C chip model can be used in a variety of applications, such as embedded systems, automotive, consumer electronics, industrial, and communications. It is a versatile chip model that can be used in a variety of different applications. In addition, it is also capable of being upgraded to meet the needs of advanced communication systems.
Case studies have shown that the XC3120-4PQ100C chip model is an effective solution for a wide range of applications. It has been used in a variety of projects, including automotive, consumer electronics, industrial, and communications. In addition, it has also been used in several 5G projects, demonstrating its capabilities in this area.
When using the XC3120-4PQ100C chip model, it is important to consider the specific design requirements of the application. It is important to ensure that the chip model is suitable for the application and that it meets all the necessary requirements. In addition, it is also important to consider the power consumption and performance requirements of the application.
In conclusion, the XC3120-4PQ100C chip model is a powerful and reliable chip model that is suitable for a wide range of applications. It is capable of meeting the needs of advanced communication systems, such as 5G, Wi-Fi 6, and other emerging technologies. In addition, it is a low-cost, low-power, and high-performance FPGA solution that is capable of being upgraded to meet the needs of advanced applications. It is important to consider the specific design requirements of the application when using the XC3120-4PQ100C chip model, as well as the power consumption and performance requirements.
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