AMD Xilinx
XC3120-4PC84C
XC3120-4PC84C ECAD Model
XC3120-4PC84C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 64 | |
| Number of Outputs | 64 | |
| Number of Logic Cells | 64 | |
| Number of Equivalent Gates | 1000 | |
| Number of CLBs | 64 | |
| Combinatorial Delay of a CLB-Max | 3.3 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | COMMERCIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 64 CLBS, 1000 GATES | |
| Additional Feature | TYP. GATES = 1000-1500 | |
| Clock Frequency-Max | 227 MHz | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.25 V | |
| Supply Voltage-Min | 4.75 V | |
| JESD-30 Code | S-PQCC-J84 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 70 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 84 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | QCCJ | |
| Package Equivalence Code | LDCC84,1.2SQ | |
| Package Shape | SQUARE | |
| Package Style | CHIP CARRIER | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | J BEND | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | QUAD | |
| Width | 29.3116 mm | |
| Length | 29.3116 mm | |
| Seated Height-Max | 5.08 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | LCC | |
| Package Description | PLASTIC, LCC-84 | |
| Pin Count | 84 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 |
XC3120-4PC84C Datasheet Download
XC3120-4PC84C Overview
The XC3120-4PC84C chip model is a powerful and versatile device that can be used in a variety of scenarios, including high-performance digital signal processing, embedded processing, and image processing. The chip model is designed to be implemented using the HDL language, which is a hardware description language used to design and document electronic systems.
The XC3120-4PC84C chip model is capable of performing complex operations and can be used for a variety of applications. It has a wide range of features, including high-performance digital signal processing, embedded processing, image processing, and more. It also has a wide range of features that make it suitable for a variety of applications, such as embedded systems, robotics, and industrial automation.
The XC3120-4PC84C chip model is an advanced device and requires a certain level of technical expertise to use it effectively. It is important to understand the product description and design requirements of the chip model in order to use it correctly. Additionally, it is important to be familiar with the HDL language, as well as the various tools and techniques used to design and document electronic systems.
The XC3120-4PC84C chip model can be used to develop and popularize future intelligent robots. It can be used to create robots that are capable of performing complex tasks and interacting with the environment. Additionally, the chip model can be used to create robots that are capable of learning and adapting to different conditions. In order to use the chip model effectively, it is important to have a strong understanding of the HDL language, as well as the various tools and techniques used to design and document electronic systems. Additionally, it is important to have a strong understanding of robotics and related technologies, such as artificial intelligence, machine learning, and computer vision.
In conclusion, the XC3120-4PC84C chip model is a powerful and versatile device that can be used in a variety of applications. It is important to understand the product description and design requirements of the chip model, as well as the HDL language and related tools and techniques, in order to use it effectively. Additionally, the chip model can be used to develop and popularize future intelligent robots, and it is important to have a strong understanding of robotics and related technologies in order to use the chip model effectively.
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|---|---|---|
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