AMD Xilinx
XC3120-3PQ100I
XC3120-3PQ100I ECAD Model
XC3120-3PQ100I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 64 | |
| Number of Outputs | 64 | |
| Number of Logic Cells | 64 | |
| Number of Equivalent Gates | 1000 | |
| Number of CLBs | 64 | |
| Combinatorial Delay of a CLB-Max | 2.7 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | RECTANGULAR | |
| Technology | CMOS | |
| Organization | 64 CLBS, 1000 GATES | |
| Additional Feature | TYP. GATES = 1000-1500 | |
| Clock Frequency-Max | 270 MHz | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.5 V | |
| Supply Voltage-Min | 4.5 V | |
| JESD-30 Code | R-PQFP-G100 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 100 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | QFP | |
| Package Equivalence Code | QFP100,.7X.9,32 | |
| Package Shape | RECTANGULAR | |
| Package Style | FLATPACK | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 650 µm | |
| Terminal Position | QUAD | |
| Width | 14 mm | |
| Length | 20 mm | |
| Seated Height-Max | 3.4 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | PLASTIC, QFP-100 | |
| Pin Count | 100 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC3120-3PQ100I Datasheet Download
XC3120-3PQ100I Overview
The chip model XC3120-3PQ100I was designed to meet the needs of the modern digital world. It is a high-performance, low-power field-programmable gate array (FPGA) that can be used to create complex systems. It is built with 100K logic cells, 1.2 million system gates, and a wide variety of user-programmable I/O pins. This allows the chip model to be used in a variety of applications, including communications, data processing, and robotics.
The original design intention of the XC3120-3PQ100I was to create a chip with the flexibility to be used in a variety of applications. The chip model can be used in advanced communication systems, as it is capable of supporting high-speed data transfer rates and a wide range of protocols. The chip model is also capable of being used in networks, as it can be integrated into existing infrastructure to create new intelligent systems. Furthermore, the chip model can be used in the development and popularization of future intelligent robots, as it is capable of supporting the necessary hardware and software components.
The chip model XC3120-3PQ100I is also capable of being upgraded in the future. This allows the chip model to be used in the era of fully intelligent systems, as it can be adapted to meet the changing needs of the digital world. To fully utilize the chip model, technical talents with knowledge of programming languages and hardware design are needed. The chip model can also be used in a variety of intelligent scenarios, such as autonomous driving, facial recognition, and natural language processing.
In conclusion, the chip model XC3120-3PQ100I was designed with the intention of being used in a variety of applications. The chip model is capable of being used in advanced communication systems, networks, and the development of intelligent robots. Furthermore, the chip model is capable of being upgraded in the future and can be used in the era of fully intelligent systems. Technical talents with knowledge of programming languages and hardware design are needed to fully utilize the chip model.
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