AMD Xilinx
XC3120-3PQ100C
XC3120-3PQ100C ECAD Model
XC3120-3PQ100C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 64 | |
| Number of Outputs | 64 | |
| Number of Logic Cells | 64 | |
| Number of Equivalent Gates | 1000 | |
| Number of CLBs | 64 | |
| Combinatorial Delay of a CLB-Max | 2.7 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | COMMERCIAL | |
| Package Shape | RECTANGULAR | |
| Technology | CMOS | |
| Organization | 64 CLBS, 1000 GATES | |
| Additional Feature | TYP. GATES = 1000-1500 | |
| Clock Frequency-Max | 270 MHz | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.25 V | |
| Supply Voltage-Min | 4.75 V | |
| JESD-30 Code | R-PQFP-G100 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 70 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 100 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | QFP | |
| Package Equivalence Code | QFP100,.7X.9 | |
| Package Shape | RECTANGULAR | |
| Package Style | FLATPACK | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 650 µm | |
| Terminal Position | QUAD | |
| Width | 14 mm | |
| Length | 20 mm | |
| Seated Height-Max | 3.4 mm | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | QFP, QFP100,.7X.9 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 | |
| Part Package Code | QFP | |
| Pin Count | 100 |
XC3120-3PQ100C Datasheet Download
XC3120-3PQ100C Overview
The XC3120-3PQ100C chip model is a high-end chip model designed and developed by a leading semiconductor manufacturer. It is a very powerful and reliable chip model, and has been widely used in various industries. It is especially suitable for applications in advanced communication systems.
The XC3120-3PQ100C chip model has a number of advantages. First, it is highly reliable and can work stably for a long time. Second, it has a low power consumption, which is beneficial to energy conservation and environmental protection. Third, it has a high integration level, which can reduce the space occupied by the chip and make it easier to install in a circuit board. Fourth, it is highly compatible, which makes it easier to integrate with other components. Fifth, it has a high processing speed, which can significantly improve the efficiency of the communication system.
The XC3120-3PQ100C chip model has been widely used in the communication industry. In the future, it is expected that the demand for this chip model will continue to increase. As the communication industry continues to develop, the demand for high-end chips will also increase, and the XC3120-3PQ100C chip model will be one of the most popular models.
The original design intention of the XC3120-3PQ100C chip model is to provide a reliable and efficient communication system. It is possible to upgrade the chip model in the future to meet the needs of more advanced communication systems. The chip model can be applied to various intelligent scenarios, including smart home systems, intelligent transportation systems, and other intelligent systems. It is also possible to use the chip model in the era of fully intelligent systems.
In conclusion, the XC3120-3PQ100C chip model is a high-end chip model with many advantages. It can be applied to advanced communication systems and various intelligent scenarios. It is expected that the demand for this chip model will continue to increase in the future, and it is possible to upgrade the chip model to meet the needs of more advanced communication systems. With its high reliability and low power consumption, the XC3120-3PQ100C chip model is a great choice for many applications in the communication industry.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||