AMD Xilinx
XC3090L-8TQ144I
XC3090L-8TQ144I ECAD Model
XC3090L-8TQ144I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 3.3 V | |
| Number of Inputs | 122 | |
| Number of Outputs | 122 | |
| Number of Logic Cells | 320 | |
| Number of Equivalent Gates | 5000 | |
| Number of CLBs | 320 | |
| Combinatorial Delay of a CLB-Max | 6.7 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 320 CLBS, 5000 GATES | |
| Additional Feature | MAX USABLE 6000 LOGIC GATES | |
| Clock Frequency-Max | 80 MHz | |
| Power Supplies | 3.3 V | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3 V | |
| JESD-30 Code | S-PQFP-G144 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 144 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFQFP | |
| Package Equivalence Code | QFP144,.87SQ,20 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, LOW PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 20 mm | |
| Length | 20 mm | |
| Seated Height-Max | 1.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | PLASTIC, TQFP-144 | |
| Pin Count | 144 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC3090L-8TQ144I Datasheet Download
XC3090L-8TQ144I Overview
The XC3090L-8TQ144I chip model is a high-performance integrated circuit designed by Xilinx, Inc. It is a system-on-chip (SoC) that can be used in advanced communication systems. The chip model is based on the Xilinx Spartan-6 FPGA architecture, which has a wide range of features and capabilities.
The original design intention of the XC3090L-8TQ144I chip model was to provide a powerful and flexible platform for creating complex systems. It has the potential to be used in a variety of applications, including high-speed communication networks, advanced robotics, and more. The chip model has the capability to support a wide range of protocols and applications, making it a versatile and powerful solution for many applications.
The XC3090L-8TQ144I chip model can be used in a variety of intelligent scenarios. It has the potential to be used in the development and popularization of future intelligent robots and other intelligent systems. The chip model has the potential to support a wide range of applications, including AI, machine learning, and more. It is also capable of supporting a wide range of communication protocols, making it an ideal solution for advanced communication systems.
In order to use the XC3090L-8TQ144I chip model effectively, it is important to have a good understanding of the chip model’s capabilities and features. Technical talents such as engineers, software developers, and embedded systems experts are needed to make use of the chip model’s features and capabilities. It is also important to understand the chip model’s limitations and how to work around them.
The XC3090L-8TQ144I chip model has the potential to be used in a variety of applications and scenarios. It is capable of supporting a wide range of protocols and applications, making it a powerful and versatile solution for many applications. The chip model has the potential to be used in the development and popularization of future intelligent robots and other intelligent systems. With the right technical talents, it is possible to make use of the chip model’s features and capabilities to create powerful and advanced systems.
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| QTY | Unit Price | Ext Price |
|---|---|---|
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