AMD Xilinx
XC3090L-8TQ144C
XC3090L-8TQ144C ECAD Model
XC3090L-8TQ144C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 3.3 V | |
| Number of Inputs | 122 | |
| Number of Outputs | 122 | |
| Number of Logic Cells | 320 | |
| Number of Equivalent Gates | 5000 | |
| Number of CLBs | 320 | |
| Combinatorial Delay of a CLB-Max | 6.7 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 320 CLBS, 5000 GATES | |
| Additional Feature | MAX USABLE 6000 LOGIC GATES | |
| Clock Frequency-Max | 80 MHz | |
| Power Supplies | 3.3 V | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3 V | |
| JESD-30 Code | S-PQFP-G144 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 144 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFQFP | |
| Package Equivalence Code | QFP144,.87SQ,20 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, LOW PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 20 mm | |
| Length | 20 mm | |
| Seated Height-Max | 1.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | PLASTIC, TQFP-144 | |
| Pin Count | 144 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC3090L-8TQ144C Datasheet Download
XC3090L-8TQ144C Overview
The XC3090L-8TQ144C chip model is a powerful and versatile processor, suitable for a variety of high-performance digital signal processing, embedded processing, and image processing applications. To program the chip, it requires the use of HDL language.
The potential of the XC3090L-8TQ144C chip model is vast and the potential applications are numerous. With the development of technology and the emergence of new technologies, the chip could be used in a variety of scenarios. It could be used in networks, providing high-performance digital signal processing, embedded processing, and image processing. It could also be used in intelligent scenarios, such as autonomous vehicles, robotics, and machine learning.
The future of the XC3090L-8TQ144C chip model is exciting, with the potential to be used in the era of fully intelligent systems. It could be used to power autonomous vehicles and robots, as well as to enable machine learning and artificial intelligence. With the development of new technologies, the chip could be used in more complex scenarios and provide more powerful capabilities.
In conclusion, the XC3090L-8TQ144C chip model is a powerful and versatile processor, suitable for a variety of high-performance digital signal processing, embedded processing, and image processing applications. It has a wide range of potential applications, from networks to intelligent scenarios, and could even be used in the era of fully intelligent systems. With the development of new technologies, the chip could be used in more complex scenarios and provide more powerful capabilities.
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| QTY | Unit Price | Ext Price |
|---|---|---|
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