AMD Xilinx
XC3090A-7TQ144C
XC3090A-7TQ144C ECAD Model
XC3090A-7TQ144C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 122 | |
| Number of Outputs | 122 | |
| Number of Logic Cells | 320 | |
| Number of Equivalent Gates | 5000 | |
| Number of CLBs | 320 | |
| Combinatorial Delay of a CLB-Max | 5.1 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 320 CLBS, 5000 GATES | |
| Additional Feature | MAX USABLE 6000 LOGIC GATES | |
| Clock Frequency-Max | 113 MHz | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.25 V | |
| Supply Voltage-Min | 4.75 V | |
| JESD-30 Code | S-PQFP-G144 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 144 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFQFP | |
| Package Equivalence Code | QFP144,.87SQ,20 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, LOW PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 20 mm | |
| Length | 20 mm | |
| Seated Height-Max | 1.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | PLASTIC, TQFP-144 | |
| Pin Count | 144 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC3090A-7TQ144C Datasheet Download
XC3090A-7TQ144C Overview
The chip model XC3090A-7TQ144C has been making waves in the industry since its introduction. It is a powerful and versatile chip model that is designed to meet the needs of a variety of applications. It is a 7-layer, 144-pin, low-power, high-performance FPGA with a wide array of features and capabilities. This chip model is a great choice for applications ranging from embedded systems to networking and communication systems.
The XC3090A-7TQ144C offers a range of advantages, such as low power consumption, high performance, and a wide variety of features. Its high-performance capabilities make it suitable for applications that require a high degree of processing power, such as embedded systems and networking systems. Its low power consumption makes it suitable for applications that require a low power draw, such as mobile devices and embedded systems. Its wide range of features make it suitable for a variety of applications, from industrial control systems to consumer electronics.
The demand for the XC3090A-7TQ144C is expected to continue to increase in the future. As the demand for more powerful and versatile chips increases, so too does the demand for the XC3090A-7TQ144C. This chip model is expected to be used in a variety of applications, such as networking systems, embedded systems, and consumer electronics. As the demand for more powerful chips increases, the demand for the XC3090A-7TQ144C is expected to increase as well.
The XC3090A-7TQ144C is also expected to be used in the era of fully intelligent systems. This chip model is capable of supporting a variety of intelligent scenarios, such as autonomous vehicles and smart home systems. The chip model is also expected to be used in networks, such as 5G networks, where it can be used to provide high-speed data transmission and low-latency connections.
In conclusion, the chip model XC3090A-7TQ144C is a powerful and versatile chip model that is suitable for a variety of applications. It offers a range of advantages, such as low power consumption, high performance, and a wide variety of features. The demand for this chip model is expected to continue to increase in the future, as the demand for more powerful and versatile chips increases. The chip model is also expected to be used in the era of fully intelligent systems, where it can be used to support a variety of intelligent scenarios. It is also expected to be used in networks, where it can be used to provide high-speed data transmission and low-latency connections.
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| QTY | Unit Price | Ext Price |
|---|---|---|
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