AMD Xilinx
XC3090A-7PQ208C
XC3090A-7PQ208C ECAD Model
XC3090A-7PQ208C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 144 | |
| Number of Outputs | 144 | |
| Number of Logic Cells | 320 | |
| Number of Equivalent Gates | 5000 | |
| Number of CLBs | 320 | |
| Combinatorial Delay of a CLB-Max | 5.1 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 320 CLBS, 5000 GATES | |
| Additional Feature | MAX USABLE 6000 LOGIC GATES | |
| Clock Frequency-Max | 113 MHz | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.25 V | |
| Supply Voltage-Min | 4.75 V | |
| JESD-30 Code | S-PQFP-G208 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 208 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | FQFP | |
| Package Equivalence Code | QFP208,1.2SQ,20 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 28 mm | |
| Length | 28 mm | |
| Seated Height-Max | 4.1 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | FQFP, QFP208,1.2SQ,20 | |
| Pin Count | 208 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 |
XC3090A-7PQ208C Datasheet Download
XC3090A-7PQ208C Overview
The XC3090A-7PQ208C chip model has been designed to meet the ever-evolving needs of the modern digital age. It is an advanced system-on-chip (SoC) that has been developed to offer a wide range of features and capabilities. It is designed to be used in a variety of industries, including communications, computing, and robotics.
The XC3090A-7PQ208C chip model is a powerful and efficient system-on-chip that offers a wide range of features and capabilities. It has been designed to provide a range of advantages, such as high performance, low power consumption, and reliable operation. It is also highly scalable, allowing for future upgrades and expansions.
In terms of its applications, the XC3090A-7PQ208C chip model is suitable for use in advanced communication systems. It is capable of providing high-speed data transmission and low latency, making it ideal for use in 5G networks and beyond. It is also suitable for use in the development and popularization of future intelligent robots, as it can be used in combination with other components to create autonomous machines.
The XC3090A-7PQ208C chip model is a powerful and efficient system-on-chip that offers a wide range of features and capabilities. It is expected to be in high demand in the future, as its features and capabilities make it suitable for use in a variety of applications. It is also highly scalable, allowing for future upgrades and expansions. In order to use the model effectively, technical talents with expertise in the areas of communications, computing, and robotics are necessary. With the right skills and expertise, the XC3090A-7PQ208C chip model can be used to create powerful and efficient systems that can be used in a variety of applications.
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| QTY | Unit Price | Ext Price |
|---|---|---|
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