AMD Xilinx
XC3090A-6PQ208C
XC3090A-6PQ208C ECAD Model
XC3090A-6PQ208C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 144 | |
| Number of Outputs | 144 | |
| Number of Logic Cells | 320 | |
| Number of Equivalent Gates | 5000 | |
| Number of CLBs | 320 | |
| Combinatorial Delay of a CLB-Max | 4.1 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 320 CLBS, 5000 GATES | |
| Additional Feature | MAX USABLE 6000 LOGIC GATES | |
| Clock Frequency-Max | 135 MHz | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.25 V | |
| Supply Voltage-Min | 4.75 V | |
| JESD-30 Code | S-PQFP-G208 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 208 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | FQFP | |
| Package Equivalence Code | QFP208,1.2SQ,20 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 28 mm | |
| Length | 28 mm | |
| Seated Height-Max | 4.1 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | FQFP, QFP208,1.2SQ,20 | |
| Pin Count | 208 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 |
XC3090A-6PQ208C Datasheet Download
XC3090A-6PQ208C Overview
The XC3090A-6PQ208C chip model is a powerful and versatile device ideal for a wide range of applications, such as high-performance digital signal processing, embedded processing, and image processing. It is designed to be programmed using the hardware description language (HDL), making it a great choice for those looking for a reliable and efficient solution.
The XC3090A-6PQ208C is a powerful tool for tackling complex computing tasks, and its use is becoming increasingly popular in the industry. It is capable of handling a wide range of tasks, from simple data processing to complex image processing. The chip is also suitable for applications such as artificial intelligence and machine learning, as well as embedded systems.
When it comes to the future of the XC3090A-6PQ208C chip model, there are a number of possibilities. As technology advances, the chip is likely to become even more powerful and versatile, allowing it to handle more complex tasks. There is also the possibility of new technologies being developed to support the chip, such as new programming languages or new algorithms.
The product description of the XC3090A-6PQ208C chip model provides detailed information on its features and capabilities. It includes information on the device's memory, processing speed, power consumption, and more. Additionally, the product description also provides information on the design requirements of the chip, such as the type of HDL language that is required and the types of applications that the chip is suitable for.
In order to get the most out of the XC3090A-6PQ208C chip model, it is important to understand the device and its capabilities. For this reason, it is beneficial to look at case studies and user guides that provide detailed information on the chip's features and design requirements. Additionally, it is important to be aware of potential issues that may arise when using the chip, such as power consumption or compatibility issues. By understanding the chip and its capabilities, users can ensure that they are using the device in the most effective and efficient way possible.
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| QTY | Unit Price | Ext Price |
|---|---|---|
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