
AMD Xilinx
XC3090A-6PQ160C
XC3090A-6PQ160C ECAD Model
XC3090A-6PQ160C Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 5 V | |
Number of Inputs | 138 | |
Number of Outputs | 138 | |
Number of Logic Cells | 320 | |
Number of Equivalent Gates | 5000 | |
Number of CLBs | 320 | |
Combinatorial Delay of a CLB-Max | 4.1 ns | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 320 CLBS, 5000 GATES | |
Additional Feature | MAX USABLE 6000 LOGIC GATES | |
Clock Frequency-Max | 135 MHz | |
Power Supplies | 5 V | |
Supply Voltage-Max | 5.25 V | |
Supply Voltage-Min | 4.75 V | |
JESD-30 Code | S-PQFP-G160 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 85 °C | |
Peak Reflow Temperature (Cel) | 225 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 160 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | QFP | |
Package Equivalence Code | QFP160,1.2SQ | |
Package Shape | SQUARE | |
Package Style | FLATPACK | |
Surface Mount | YES | |
Terminal Finish | Tin/Lead (Sn85Pb15) | |
Terminal Form | GULL WING | |
Terminal Pitch | 650 µm | |
Terminal Position | QUAD | |
Width | 28 mm | |
Length | 28 mm | |
Seated Height-Max | 4.1 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | QFP | |
Package Description | QFP, QFP160,1.2SQ | |
Pin Count | 160 | |
Reach Compliance Code | not_compliant | |
HTS Code | 8542.39.00.01 |
XC3090A-6PQ160C Datasheet Download
XC3090A-6PQ160C Overview
The XC3090A-6PQ160C chip model is a powerful and versatile tool for high-performance digital signal processing, embedded processing, and image processing. It is designed to handle complex tasks with ease and provide superior performance. This chip model is capable of supporting a wide range of applications, from simple digital signal processing to complex image processing.
The XC3090A-6PQ160C chip model is designed to be used with the HDL language. This language allows for the creation of complex algorithms and the optimization of code for better performance. The chip model is also designed to be able to be upgraded with new features and capabilities in the future, making it a great choice for advanced communication systems.
The product description of the XC3090A-6PQ160C chip model outlines the features and capabilities of the chip. It is designed to be highly efficient and powerful, with a wide range of functions and features. The chip is also designed to be highly configurable, allowing users to tailor the chip to their specific needs.
In addition to the product description, there are also several case studies and precautions that should be taken when using the XC3090A-6PQ160C chip model. These case studies provide insight into how the chip can be used in various applications and provide insight into potential issues that may arise. It is important to understand the potential risks associated with using the chip model before attempting to use it.
Overall, the XC3090A-6PQ160C chip model is a powerful and versatile tool for high-performance digital signal processing, embedded processing, and image processing. It is designed to be used with the HDL language and can be upgraded with new features and capabilities in the future. The product description outlines the features and capabilities of the chip, and there are also several case studies and precautions that should be taken when using the chip. With proper understanding and use, the XC3090A-6PQ160C chip model can be a great choice for advanced communication systems.
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2,299 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $65.6863 | $65.6863 |
10+ | $64.9800 | $649.7997 |
100+ | $61.4484 | $6,144.8448 |
1000+ | $57.9169 | $28,958.4640 |
10000+ | $52.9728 | $52,972.8000 |
The price is for reference only, please refer to the actual quotation! |