AMD Xilinx
XC3090-70PQ160C
XC3090-70PQ160C ECAD Model
XC3090-70PQ160C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 138 | |
| Number of Outputs | 138 | |
| Number of Logic Cells | 320 | |
| Number of Equivalent Gates | 5000 | |
| Number of CLBs | 320 | |
| Combinatorial Delay of a CLB-Max | 9 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 320 CLBS, 5000 GATES | |
| Additional Feature | 928 FLIP-FLOPS; TYP. GATES = 5000-6000; POWER-DOWN SUPPLY CURRENT = 250UA | |
| Clock Frequency-Max | 70 MHz | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.25 V | |
| Supply Voltage-Min | 4.75 V | |
| JESD-30 Code | S-PQFP-G160 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 160 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | QFP | |
| Package Equivalence Code | QFP160,1.2SQ | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 650 µm | |
| Terminal Position | QUAD | |
| Width | 28 mm | |
| Length | 28 mm | |
| Seated Height-Max | 3.92 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | QFP, QFP160,1.2SQ | |
| Pin Count | 160 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC3090-70PQ160C Datasheet Download
XC3090-70PQ160C Overview
The XC3090-70PQ160C chip model is a powerful, high-performance digital signal processor that is suitable for a variety of applications, such as embedded processing, image processing, and more. It is designed to be compatible with HDL language, making it easier for developers to create complex and sophisticated programs.
The chip model is ideal for a variety of industries, including aerospace, automotive, telecommunications, and consumer electronics. It offers a range of benefits, such as high speed, low power consumption, and increased data throughput. It also offers a wide range of features, such as a high-level of integration, a fast clock speed, and a large memory capacity.
As the demand for digital signal processing continues to grow, the XC3090-70PQ160C chip model is expected to remain in demand in the coming years. It is likely to be used in a variety of industries, from consumer electronics to aerospace and automotive. As the technology continues to evolve, the chip model is likely to be adapted to new applications, such as machine learning and artificial intelligence.
The XC3090-70PQ160C chip model is likely to be in high demand in the future, as it offers a range of benefits for developers. It is fast, efficient, and reliable, making it an ideal choice for a variety of applications. Additionally, it is compatible with HDL language, which makes it easier for developers to create complex and sophisticated programs. As the demand for digital signal processing continues to grow, the XC3090-70PQ160C chip model is expected to remain in high demand in the coming years.
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1,238 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $17.4096 | $17.4096 |
| 10+ | $17.2224 | $172.2240 |
| 100+ | $16.2864 | $1,628.6400 |
| 1000+ | $15.3504 | $7,675.2000 |
| 10000+ | $14.0400 | $14,040.0000 |
| The price is for reference only, please refer to the actual quotation! | ||