AMD Xilinx
XC3090-70PG175B
XC3090-70PG175B ECAD Model
XC3090-70PG175B Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 144 | |
| Number of Outputs | 144 | |
| Number of Logic Cells | 320 | |
| Number of Equivalent Gates | 5000 | |
| Number of CLBs | 320 | |
| Combinatorial Delay of a CLB-Max | 9 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Screening Level | MIL-STD-883 Class B | |
| Temperature Grade | MILITARY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 320 CLBS, 5000 GATES | |
| Additional Feature | 928 FLIP-FLOPS; TYP. GATES = 5000-6000; POWER-DOWN SUPPLY CURRENT = 250UA | |
| Clock Frequency-Max | 70 MHz | |
| Power Supplies | 5 V | |
| JESD-30 Code | S-CPGA-P175 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e3 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Number of Terminals | 175 | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | PGA | |
| Package Equivalence Code | PGA176,16X16MOD | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | NO | |
| Terminal Finish | MATTE TIN | |
| Terminal Form | PIN/PEG | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | PERPENDICULAR | |
| Width | 42.164 mm | |
| Length | 42.164 mm | |
| Seated Height-Max | 4.318 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | PGA | |
| Package Description | CERAMIC, PGA-175 | |
| Pin Count | 175 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | 3A001.A.2.C |
XC3090-70PG175B Datasheet Download
XC3090-70PG175B Overview
The XC3090-70PG175B chip model is a powerful tool for digital signal processing, embedded processing, and image processing. It is designed to be used with the HDL language, which is a powerful, yet complex tool for designing and programming digital logic circuits. This chip model is ideal for high-performance applications, as it can handle a large amount of data quickly and efficiently.
The industry trends for the XC3090-70PG175B chip model and related industries is constantly evolving. As new technologies and advancements become available, the chip model may need to be adapted to take advantage of them. For example, new technologies such as artificial intelligence and machine learning may require the chip model to be updated to support the new capabilities.
The XC3090-70PG175B chip model can be used in the development and popularization of future intelligent robots. It can be used to process data quickly and efficiently, as well as to develop complex algorithms. The technical talents needed to use the chip model effectively include knowledge of HDL programming, as well as knowledge of artificial intelligence and machine learning. Additionally, knowledge of robotics and other related technologies will be necessary to take full advantage of the chip model.
Overall, the XC3090-70PG175B chip model is a powerful tool for digital signal processing, embedded processing, and image processing. It is designed to be used with the HDL language and can be used in the development and popularization of future intelligent robots. To use the chip model effectively, technical talents such as knowledge of HDL programming, as well as knowledge of artificial intelligence and machine learning, must be acquired.
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| QTY | Unit Price | Ext Price |
|---|---|---|
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