
AMD Xilinx
XC3090-70CB164M
XC3090-70CB164M ECAD Model
XC3090-70CB164M Attributes
Type | Description | Select |
---|---|---|
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 5 V | |
Number of Inputs | 142 | |
Number of Outputs | 142 | |
Number of Logic Cells | 320 | |
Number of Equivalent Gates | 5000 | |
Number of CLBs | 320 | |
Combinatorial Delay of a CLB-Max | 9 ns | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | MILITARY | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 320 CLBS, 5000 GATES | |
Additional Feature | 928 FLIP-FLOPS; TYP. GATES = 5000-6000; POWER-DOWN SUPPLY CURRENT = 250UA | |
Clock Frequency-Max | 70 MHz | |
Power Supplies | 5 V | |
JESD-30 Code | S-CQFP-F164 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -55 °C | |
Number of Terminals | 164 | |
Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
Package Code | GQFF | |
Package Equivalence Code | TAPEPAK,164P,.025 | |
Package Shape | SQUARE | |
Package Style | FLATPACK, GUARD RING | |
Surface Mount | YES | |
Terminal Finish | TIN LEAD | |
Terminal Form | FLAT | |
Terminal Pitch | 650 µm | |
Terminal Position | QUAD | |
Width | 28.702 mm | |
Length | 28.702 mm | |
Seated Height-Max | 2.921 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | QFP | |
Package Description | GQFF, TAPEPAK,164P,.025 | |
Pin Count | 164 | |
Reach Compliance Code | unknown | |
HTS Code | 8542.39.00.01 | |
ECCN Code | 3A001.A.2.C |
XC3090-70CB164M Datasheet Download
XC3090-70CB164M Overview
The chip model XC3090-70CB164M is a powerful new microchip that has the potential to revolutionize the way we use networks and create intelligent systems. This chip model has been designed to provide high performance, low power consumption, and a wide range of features. It is equipped with a 16-bit processor, a high-speed memory controller, and a variety of peripherals.
The XC3090-70CB164M is suitable for a wide range of applications, including industrial automation, medical diagnostics, and robotics. It is also well-suited for use in the development and popularization of future intelligent robots. With its powerful processing capabilities, the chip model is capable of performing complex calculations and making decisions quickly and accurately.
In terms of its potential applications in networks, the XC3090-70CB164M is capable of connecting to multiple devices and networks. This allows for the creation of sophisticated and reliable communication systems, as well as the development of intelligent scenarios. It is even possible to use the chip model to create fully intelligent systems, where the chip model is able to learn from its environment and make decisions based on its observations.
In order to use the chip model XC3090-70CB164M effectively, it is important to understand its design requirements. The chip model is designed to operate in a wide range of temperatures and pressures, and it is also capable of withstanding high levels of vibration. It is also important to ensure that the chip model is properly cooled, as overheating can cause the chip model to malfunction.
In addition, it is important to ensure that the chip model is properly programmed. This requires a certain level of technical expertise, as the chip model is capable of performing complex calculations and making decisions quickly and accurately. As such, it is important to have the right technical talent on hand to ensure that the chip model is used effectively.
The XC3090-70CB164M chip model is an incredibly powerful microchip that has the potential to revolutionize the way we use networks and create intelligent systems. It is capable of connecting to multiple devices and networks, and it is also well-suited for use in the development and popularization of future intelligent robots. With its powerful processing capabilities and its ability to learn from its environment, the chip model is an incredibly useful tool for creating sophisticated and reliable communication systems, as well as intelligent scenarios. In order to use the chip model effectively, however, it is important to understand its design requirements and have the right technical talent on hand. With the right knowledge and skills, the XC3090-70CB164M chip model can be a powerful tool for creating the future of intelligent systems.
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Pricing (USD)
QTY | Unit Price | Ext Price |
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