XC3090-70CB164M
XC3090-70CB164M
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rohs

AMD Xilinx

XC3090-70CB164M


XC3090-70CB164M
F20-XC3090-70CB164M
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, GQFF, TAPEPAK,164P,.025
GQFF, TAPEPAK,164P,.025

XC3090-70CB164M ECAD Model


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XC3090-70CB164M Attributes


Type Description Select
Rohs Code No
Part Life Cycle Code Obsolete
Supply Voltage-Nom 5 V
Number of Inputs 142
Number of Outputs 142
Number of Logic Cells 320
Number of Equivalent Gates 5000
Number of CLBs 320
Combinatorial Delay of a CLB-Max 9 ns
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade MILITARY
Package Shape SQUARE
Technology CMOS
Organization 320 CLBS, 5000 GATES
Additional Feature 928 FLIP-FLOPS; TYP. GATES = 5000-6000; POWER-DOWN SUPPLY CURRENT = 250UA
Clock Frequency-Max 70 MHz
Power Supplies 5 V
JESD-30 Code S-CQFP-F164
Qualification Status Not Qualified
JESD-609 Code e0
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Number of Terminals 164
Package Body Material CERAMIC, METAL-SEALED COFIRED
Package Code GQFF
Package Equivalence Code TAPEPAK,164P,.025
Package Shape SQUARE
Package Style FLATPACK, GUARD RING
Surface Mount YES
Terminal Finish TIN LEAD
Terminal Form FLAT
Terminal Pitch 650 µm
Terminal Position QUAD
Width 28.702 mm
Length 28.702 mm
Seated Height-Max 2.921 mm
Ihs Manufacturer XILINX INC
Part Package Code QFP
Package Description GQFF, TAPEPAK,164P,.025
Pin Count 164
Reach Compliance Code unknown
HTS Code 8542.39.00.01
ECCN Code 3A001.A.2.C

XC3090-70CB164M Datasheet Download


XC3090-70CB164M Overview



The chip model XC3090-70CB164M is a powerful new microchip that has the potential to revolutionize the way we use networks and create intelligent systems. This chip model has been designed to provide high performance, low power consumption, and a wide range of features. It is equipped with a 16-bit processor, a high-speed memory controller, and a variety of peripherals.


The XC3090-70CB164M is suitable for a wide range of applications, including industrial automation, medical diagnostics, and robotics. It is also well-suited for use in the development and popularization of future intelligent robots. With its powerful processing capabilities, the chip model is capable of performing complex calculations and making decisions quickly and accurately.


In terms of its potential applications in networks, the XC3090-70CB164M is capable of connecting to multiple devices and networks. This allows for the creation of sophisticated and reliable communication systems, as well as the development of intelligent scenarios. It is even possible to use the chip model to create fully intelligent systems, where the chip model is able to learn from its environment and make decisions based on its observations.


In order to use the chip model XC3090-70CB164M effectively, it is important to understand its design requirements. The chip model is designed to operate in a wide range of temperatures and pressures, and it is also capable of withstanding high levels of vibration. It is also important to ensure that the chip model is properly cooled, as overheating can cause the chip model to malfunction.


In addition, it is important to ensure that the chip model is properly programmed. This requires a certain level of technical expertise, as the chip model is capable of performing complex calculations and making decisions quickly and accurately. As such, it is important to have the right technical talent on hand to ensure that the chip model is used effectively.


The XC3090-70CB164M chip model is an incredibly powerful microchip that has the potential to revolutionize the way we use networks and create intelligent systems. It is capable of connecting to multiple devices and networks, and it is also well-suited for use in the development and popularization of future intelligent robots. With its powerful processing capabilities and its ability to learn from its environment, the chip model is an incredibly useful tool for creating sophisticated and reliable communication systems, as well as intelligent scenarios. In order to use the chip model effectively, however, it is important to understand its design requirements and have the right technical talent on hand. With the right knowledge and skills, the XC3090-70CB164M chip model can be a powerful tool for creating the future of intelligent systems.



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