XC3090-50CB164M
XC3090-50CB164M
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rohs

AMD Xilinx

XC3090-50CB164M


XC3090-50CB164M
F20-XC3090-50CB164M
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, GQFF
GQFF

XC3090-50CB164M ECAD Model


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XC3090-50CB164M Attributes


Type Description Select
Part Life Cycle Code Obsolete
Supply Voltage-Nom 5 V
Number of Equivalent Gates 5000
Number of CLBs 320
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade MILITARY
Package Shape SQUARE
Technology CMOS
Organization 320 CLBS, 5000 GATES
Additional Feature 928 FLIP-FLOPS; TYP. GATES = 5000-6000; POWER-DOWN SUPPLY CURRENT = 250UA
Clock Frequency-Max 50 MHz
JESD-30 Code S-CQFP-F164
Qualification Status Not Qualified
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Number of Terminals 164
Package Body Material CERAMIC, METAL-SEALED COFIRED
Package Code GQFF
Package Shape SQUARE
Package Style FLATPACK, GUARD RING
Surface Mount YES
Terminal Form FLAT
Terminal Pitch 650 µm
Terminal Position QUAD
Width 28.702 mm
Length 28.702 mm
Seated Height-Max 2.921 mm
Ihs Manufacturer XILINX INC
Part Package Code QFP
Package Description GQFF,
Pin Count 164
Reach Compliance Code unknown
ECCN Code 3A001.A.2.C
HTS Code 8542.39.00.01

XC3090-50CB164M Datasheet Download


XC3090-50CB164M Overview



The chip model XC3090-50CB164M is a highly advanced type of semiconductor chip designed for use in a variety of applications. It is capable of providing reliable performance in a wide range of environments, from the most demanding industrial environments to the most cutting-edge consumer devices. Its versatile design makes it a popular choice for many types of applications, from network and storage solutions to robotics and artificial intelligence.


In terms of industry trends, the XC3090-50CB164M is well-positioned to take advantage of the growing demand for intelligent systems. As technology continues to advance, the need for faster and more powerful chips is becoming increasingly important. The XC3090-50CB164M is capable of meeting this demand, offering high-performance processing and memory capabilities. This makes it an ideal choice for applications such as network and storage solutions, as well as for use in robotics and artificial intelligence.


The XC3090-50CB164M is also capable of being used in the era of fully intelligent systems. Its powerful processing capabilities make it an ideal choice for applications such as machine learning and deep learning. This means that it is capable of powering the development of intelligent robots and other automated systems. In addition, the XC3090-50CB164M is capable of supporting a variety of new technologies, such as 5G networks and the Internet of Things.


In order to make full use of the XC3090-50CB164M, technical talents are needed. This includes engineers who are knowledgeable in the design and development of semiconductor chips, as well as those who are familiar with the programming and application of the chip. Additionally, those who are skilled in the development and popularization of artificial intelligence and robotics are also needed to make the most out of the XC3090-50CB164M.


In conclusion, the XC3090-50CB164M is a highly advanced type of semiconductor chip that is capable of providing reliable performance in a wide range of environments. It is well-positioned to take advantage of the growing demand for intelligent systems and is capable of being used in the era of fully intelligent systems. It is also capable of supporting a variety of new technologies, such as 5G networks and the Internet of Things. In order to make full use of the XC3090-50CB164M, technical talents with knowledge in the design and development of semiconductor chips, as well as those skilled in the development and popularization of artificial intelligence and robotics, are needed.



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