
AMD Xilinx
XC3090-125PQ208C
XC3090-125PQ208C ECAD Model
XC3090-125PQ208C Attributes
Type | Description | Select |
---|---|---|
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 5 V | |
Number of Inputs | 144 | |
Number of Outputs | 144 | |
Number of Logic Cells | 320 | |
Number of Equivalent Gates | 5000 | |
Number of CLBs | 320 | |
Combinatorial Delay of a CLB-Max | 5.5 ns | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 320 CLBS, 5000 GATES | |
Additional Feature | 928 FLIP-FLOPS; TYP. GATES = 5000-6000; POWER-DOWN SUPPLY CURRENT = 250UA | |
Clock Frequency-Max | 125 MHz | |
Power Supplies | 5 V | |
Supply Voltage-Max | 5.25 V | |
Supply Voltage-Min | 4.75 V | |
JESD-30 Code | S-PQFP-G208 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 85 °C | |
Peak Reflow Temperature (Cel) | 225 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 208 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | FQFP | |
Package Equivalence Code | QFP208,1.2SQ,20 | |
Package Shape | SQUARE | |
Package Style | FLATPACK, FINE PITCH | |
Surface Mount | YES | |
Terminal Finish | TIN LEAD | |
Terminal Form | GULL WING | |
Terminal Pitch | 500 µm | |
Terminal Position | QUAD | |
Width | 28 mm | |
Length | 28 mm | |
Seated Height-Max | 3.92 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | QFP | |
Package Description | FQFP, QFP208,1.2SQ,20 | |
Pin Count | 208 | |
Reach Compliance Code | unknown | |
HTS Code | 8542.39.00.01 |
XC3090-125PQ208C Datasheet Download
XC3090-125PQ208C Overview
The XC3090-125PQ208C chip model was designed to provide users with a high-performance, low-power solution for their computing needs. It is a field-programmable gate array (FPGA) that is capable of handling a wide variety of tasks, from simple logic operations to complex communication protocols. It is a powerful tool that can be used to create highly efficient and reliable systems.
The XC3090-125PQ208C chip model is capable of being upgraded to meet the ever-evolving needs of users. It can be used in advanced communication systems, such as 5G networks, to provide faster and more reliable data transmission. It can also be used to develop and popularize future intelligent robots, as it has the necessary capabilities to process and analyze large amounts of data.
The XC3090-125PQ208C chip model is a great choice for those looking to build new and innovative intelligent systems. It can be used to create intelligent scenarios such as smart home automation, facial recognition, and autonomous vehicles. It is also capable of being used in the era of fully intelligent systems, such as the Internet of Things (IoT).
In order to use the XC3090-125PQ208C chip model effectively, it is important to have the necessary technical skills and knowledge. This includes understanding logic operations, communication protocols, and programming languages. It is also important to have experience with FPGA development, as this will help in creating efficient and reliable systems.
The XC3090-125PQ208C chip model is a great choice for those looking to create innovative and intelligent systems. It is capable of being upgraded to meet the ever-evolving needs of users, and can be used in advanced communication systems as well as in the era of fully intelligent systems. With the right technical skills and knowledge, the XC3090-125PQ208C chip model can be used to create powerful and reliable systems, and can even be used to develop and popularize future intelligent robots.
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3,164 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $85.6552 | $85.6552 |
10+ | $84.7342 | $847.3421 |
100+ | $80.1291 | $8,012.9088 |
1000+ | $75.5240 | $37,761.9840 |
10000+ | $69.0768 | $69,076.8000 |
The price is for reference only, please refer to the actual quotation! |