AMD Xilinx
XC3090-100PQ160I
XC3090-100PQ160I ECAD Model
XC3090-100PQ160I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 138 | |
| Number of Outputs | 138 | |
| Number of Logic Cells | 320 | |
| Number of Equivalent Gates | 5000 | |
| Number of CLBs | 320 | |
| Combinatorial Delay of a CLB-Max | 7 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 320 CLBS, 5000 GATES | |
| Additional Feature | 928 FLIP-FLOPS; TYP. GATES = 5000-6000; POWER-DOWN SUPPLY CURRENT = 250UA | |
| Clock Frequency-Max | 100 MHz | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.5 V | |
| Supply Voltage-Min | 4.5 V | |
| JESD-30 Code | S-PQFP-G160 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 160 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | QFP | |
| Package Equivalence Code | QFP160,1.2SQ | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 650 µm | |
| Terminal Position | QUAD | |
| Width | 28 mm | |
| Length | 28 mm | |
| Seated Height-Max | 3.92 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | QFP, QFP160,1.2SQ | |
| Pin Count | 160 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC3090-100PQ160I Datasheet Download
XC3090-100PQ160I Overview
The XC3090-100PQ160I chip model is a high performance, low power, and highly integrated system-on-chip (SoC) solution designed for advanced communication systems. It is the latest addition to the Xilinx FPGA family of products, offering a wide range of features and capabilities.
The XC3090-100PQ160I is designed to provide a high-performance, low-power, and cost-effective solution for advanced communication systems. It features a low-power and low-cost FPGA core, as well as a high-speed, high-bandwidth, multi-channel memory interface. The chip also includes a wide range of peripherals, including a high-speed serial port, an Ethernet MAC, and a USB interface.
The XC3090-100PQ160I chip model offers a number of advantages over other FPGA solutions. First, it is designed to provide a low-power solution for advanced communication systems. This means that the chip can be used in applications that require a high degree of power efficiency. Additionally, the chip offers a high-performance, low-cost solution for a wide range of applications. The chip also offers a wide range of features and capabilities, including a high-speed serial port, an Ethernet MAC, and a USB interface.
The XC3090-100PQ160I chip model is designed to be highly upgradeable. It is designed to support future upgrades, such as additional memory and peripheral support, as well as additional features and capabilities. This makes the chip an ideal solution for applications that require a high degree of flexibility and upgradability.
The XC3090-100PQ160I chip model is also designed to meet the specific design requirements of advanced communication systems. It is designed to provide a low-power solution for a wide range of applications, including wireless communication, satellite communication, and digital television. Additionally, the chip is designed to support a wide range of features and capabilities, including a high-speed serial port, an Ethernet MAC, and a USB interface.
The XC3090-100PQ160I chip model is expected to be in high demand in the future, as it is designed to provide a low-power, high-performance, and cost-effective solution for advanced communication systems. Additionally, the chip is designed to be highly upgradeable, making it an ideal solution for applications that require a high degree of flexibility and upgradability. Finally, the chip is designed to meet the specific design requirements of advanced communication systems, making it an ideal solution for a wide range of applications.
When designing a system utilizing the XC3090-100PQ160I chip model, it is important to consider the specific design requirements of the application. In addition, it is important to be aware of the potential risks associated with the chip, such as power consumption and reliability. Additionally, it is important to ensure that the chip is properly configured for the application, as incorrect configuration can lead to unexpected results. Finally, it is important to ensure that the chip is properly tested and verified before use in a production system.
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3,061 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $6.9750 | $6.9750 |
| 10+ | $6.9000 | $69.0000 |
| 100+ | $6.5250 | $652.5000 |
| 1000+ | $6.1500 | $3,075.0000 |
| 10000+ | $5.6250 | $5,625.0000 |
| The price is for reference only, please refer to the actual quotation! | ||