AMD Xilinx
XC3090-100PG175M
XC3090-100PG175M ECAD Model
XC3090-100PG175M Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 144 | |
| Number of Outputs | 144 | |
| Number of Logic Cells | 320 | |
| Number of Equivalent Gates | 5000 | |
| Number of CLBs | 320 | |
| Combinatorial Delay of a CLB-Max | 7 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | MILITARY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 320 CLBS, 5000 GATES | |
| Additional Feature | 928 FLIP-FLOPS; TYP. GATES = 5000-6000; POWER-DOWN SUPPLY CURRENT = 250UA | |
| Clock Frequency-Max | 100 MHz | |
| Power Supplies | 5 V | |
| JESD-30 Code | S-CPGA-P175 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Number of Terminals | 175 | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | PGA | |
| Package Equivalence Code | PGA175,16X16 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | NO | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | PIN/PEG | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | PERPENDICULAR | |
| Width | 42.164 mm | |
| Length | 42.164 mm | |
| Seated Height-Max | 3.81 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | PGA | |
| Package Description | PGA, PGA175,16X16 | |
| Pin Count | 175 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | 3A001.A.2.C |
XC3090-100PG175M Datasheet Download
XC3090-100PG175M Overview
The XC3090-100PG175M chip model is a cutting-edge technology developed by Xilinx, a world-leading provider of programmable logic devices. It is a powerful and highly reliable FPGA chip that can be used in various applications, such as high-speed communication, video processing, and embedded systems.
The XC3090-100PG175M chip model is designed for high-performance applications with a wide range of features. It has a high-speed transceiver and advanced signal processing capabilities, allowing it to be used in advanced communication systems. It also has a large number of programmable logic blocks, making it suitable for a variety of applications. Furthermore, its comprehensive design and debugging tools make it easy to use and configure.
The XC3090-100PG175M chip model is designed to be highly reliable and robust. It has a wide operating temperature range, allowing it to be used in harsh environments. It is also designed to be highly efficient, with low power consumption and high performance.
In terms of industry trends, the XC3090-100PG175M chip model is set to continue to be in demand. As technology advances, the demand for high-performance and reliable FPGAs will continue to grow. Furthermore, the need for new technologies to support the application environment will also increase.
The XC3090-100PG175M chip model is designed to be upgradeable, allowing for future upgrades and enhancements. This means that it can be used for a variety of applications, from basic to advanced. Furthermore, it can be used in a variety of communication systems, from low-speed to high-speed.
In order to ensure the successful use of the XC3090-100PG175M chip model, it is important to understand the product description and specific design requirements. It is also important to consider the actual case studies and precautions to ensure that the chip model is used correctly and safely.
In conclusion, the XC3090-100PG175M chip model is a powerful and reliable FPGA chip that can be used in various applications. It is designed to be upgradeable and can be used in a variety of communication systems. It is also important to understand the product description and specific design requirements, as well as the actual case studies and precautions, in order to ensure the successful use of the chip model. As technology advances, the demand for high-performance and reliable FPGAs will continue to grow, and the need for new technologies to support the application environment will also increase.
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| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||