AMD Xilinx
XC3090-100PG175B
XC3090-100PG175B ECAD Model
XC3090-100PG175B Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 144 | |
| Number of Outputs | 144 | |
| Number of Logic Cells | 320 | |
| Number of Equivalent Gates | 5000 | |
| Number of CLBs | 320 | |
| Combinatorial Delay of a CLB-Max | 7 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Screening Level | MIL-STD-883 Class B | |
| Temperature Grade | MILITARY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 320 CLBS, 5000 GATES | |
| Additional Feature | 928 FLIP-FLOPS; TYP. GATES = 5000-6000; POWER-DOWN SUPPLY CURRENT = 250UA | |
| Clock Frequency-Max | 100 MHz | |
| Power Supplies | 5 V | |
| JESD-30 Code | S-CPGA-P175 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Number of Terminals | 175 | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | PGA | |
| Package Equivalence Code | PGA175,16X16 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | NO | |
| Terminal Form | PIN/PEG | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | PERPENDICULAR | |
| Width | 42.164 mm | |
| Length | 42.164 mm | |
| Seated Height-Max | 4.318 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | PGA | |
| Package Description | PGA, PGA175,16X16 | |
| Pin Count | 175 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | 3A001.A.2.C |
XC3090-100PG175B Datasheet Download
XC3090-100PG175B Overview
The XC3090-100PG175B chip model is an advanced integrated circuit (IC) designed to meet the specific needs of modern communication systems. It is a high-performance, low-power, and low-cost solution for a range of applications, such as cellular base stations, wireless access points, and routers. It is also suitable for use in advanced communication systems, such as 5G, Wi-Fi 6, and LTE-A.
The XC3090-100PG175B chip model is designed to provide flexible and reliable performance, while consuming low power. Its features include a 32-bit ARM Cortex-A7 processor, 64KB of SRAM, and a 100-pin package. It also has a wide range of integrated peripherals, such as Ethernet, USB, UART, I2C, and SPI, as well as support for multiple communication protocols. It is also compatible with a variety of operating systems, such as Linux, Windows, and Android.
The XC3090-100PG175B chip model is also designed for future upgradability. It can be used to develop and deploy new applications and features, such as voice recognition, image processing, and AI. It can also be used to improve existing applications and features, such as security and network performance. This makes it an ideal solution for the development and popularization of future intelligent robots.
In order to use the XC3090-100PG175B chip model effectively, a range of technical talents are needed. These include software engineers, hardware engineers, and system architects. They should be familiar with the design and development of embedded systems, as well as the latest communication protocols and operating systems. They should also have a good understanding of the chip model’s features and capabilities, as well as its potential for future upgrades.
When using the XC3090-100PG175B chip model, it is important to be aware of the potential risks and limitations. For example, it is important to ensure that the chip model is compatible with the application it is being used for, as well as the operating system and communication protocols. It is also important to ensure that the chip model is properly configured and that any security measures are in place. Finally, it is important to keep up to date with any updates or changes to the chip model, as these can have an impact on its performance.
In conclusion, the XC3090-100PG175B chip model is an advanced integrated circuit designed to meet the specific needs of modern communication systems. It is designed to provide flexible and reliable performance, while consuming low power. It is also designed for future upgradability, making it an ideal solution for the development and popularization of future intelligent robots. In order to use the XC3090-100PG175B chip model effectively, a range of technical talents are needed, and it is important to be aware of the potential risks and limitations.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||