AMD Xilinx
XC3090-100CB164M
XC3090-100CB164M ECAD Model
XC3090-100CB164M Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 142 | |
| Number of Outputs | 142 | |
| Number of Logic Cells | 320 | |
| Number of Equivalent Gates | 5000 | |
| Number of CLBs | 320 | |
| Combinatorial Delay of a CLB-Max | 7 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | MILITARY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 320 CLBS, 5000 GATES | |
| Additional Feature | 928 FLIP-FLOPS; TYP. GATES = 5000-6000; POWER-DOWN SUPPLY CURRENT = 250UA | |
| Clock Frequency-Max | 100 MHz | |
| Power Supplies | 5 V | |
| JESD-30 Code | S-CQFP-F164 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 1 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Number of Terminals | 164 | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | GQFF | |
| Package Equivalence Code | TAPEPAK,164P,.025 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, GUARD RING | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | FLAT | |
| Terminal Pitch | 650 µm | |
| Terminal Position | QUAD | |
| Width | 28.702 mm | |
| Length | 28.702 mm | |
| Seated Height-Max | 2.921 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | GQFF, TAPEPAK,164P,.025 | |
| Pin Count | 164 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A001.A.2.C | |
| HTS Code | 8542.39.00.01 |
XC3090-100CB164M Datasheet Download
XC3090-100CB164M Overview
The chip model XC3090-100CB164M is a powerful and versatile chip model that has been widely used in the industry. It is designed to provide a cost-effective solution for a wide range of applications. With its excellent performance and advanced features, the chip model XC3090-100CB164M has become an indispensable part of many industries.
The chip model XC3090-100CB164M is designed to meet the needs of the market. It has been designed for high-performance, low-power consumption, and cost-efficiency. The chip model XC3090-100CB164M is capable of performing complex tasks such as data processing, memory management, networking, and communication. It also has the capability to support advanced communication systems.
In terms of industry trends, the chip model XC3090-100CB164M is expected to continue to be used in the future. It is likely that the chip model will be upgraded in order to provide better performance and to keep up with the latest technological advancements. It is also possible that the chip model will be applied to the development and popularization of future intelligent robots.
In order to effectively use the chip model XC3090-100CB164M, specialized technical talents are needed. Technical professionals should have a thorough understanding of the chip model's features and capabilities. They should also be familiar with the development tools and techniques used to program the chip model. Additionally, they should be knowledgeable in the latest technologies and trends in the industry.
To summarize, the chip model XC3090-100CB164M is a powerful and versatile chip model that has been widely used in the industry. It is designed to provide a cost-effective solution for a wide range of applications. The chip model is expected to continue to be used in the future and may be upgraded in order to keep up with the latest technologies. Additionally, it may be applied to the development and popularization of future intelligent robots. In order to effectively use the chip model, specialized technical talents are needed.
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| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||