
AMD Xilinx
XC3090-100CB164B
XC3090-100CB164B ECAD Model
XC3090-100CB164B Attributes
Type | Description | Select |
---|---|---|
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 5 V | |
Number of Inputs | 142 | |
Number of Outputs | 142 | |
Number of Logic Cells | 320 | |
Number of Equivalent Gates | 5000 | |
Number of CLBs | 320 | |
Combinatorial Delay of a CLB-Max | 7 ns | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Screening Level | MIL-STD-883 Class B | |
Temperature Grade | MILITARY | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 320 CLBS, 5000 GATES | |
Additional Feature | 928 FLIP-FLOPS; TYP. GATES = 5000-6000; POWER-DOWN SUPPLY CURRENT = 250UA | |
Clock Frequency-Max | 100 MHz | |
Power Supplies | 5 V | |
JESD-30 Code | S-CQFP-F164 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 1 | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -55 °C | |
Number of Terminals | 164 | |
Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
Package Code | GQFF | |
Package Equivalence Code | TAPEPAK,164P,.025 | |
Package Shape | SQUARE | |
Package Style | FLATPACK, GUARD RING | |
Surface Mount | YES | |
Terminal Finish | TIN LEAD | |
Terminal Form | FLAT | |
Terminal Pitch | 650 µm | |
Terminal Position | QUAD | |
Width | 28.702 mm | |
Length | 28.702 mm | |
Seated Height-Max | 3.302 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | QFP | |
Package Description | GQFF, TAPEPAK,164P,.025 | |
Pin Count | 164 | |
Reach Compliance Code | unknown | |
ECCN Code | 3A001.A.2.C | |
HTS Code | 8542.39.00.01 |
XC3090-100CB164B Datasheet Download
XC3090-100CB164B Overview
The chip model XC3090-100CB164B is a new technology developed by the semiconductor company Xilinx. It is a high-performance, low-power, and cost-effective Field Programmable Gate Array (FPGA). This chip model is designed to meet the needs of a wide range of applications, including data centers, embedded systems, and aerospace applications.
The XC3090-100CB164B chip model offers a variety of advantages. It has a large number of configurable logic blocks, a high-speed transceiver, and a wide range of I/O capabilities. It also has a low-power, low-cost design, making it suitable for a variety of applications. The chip model also supports a wide range of development tools, including the Vivado Design Suite, which provides a comprehensive set of development tools for the FPGA.
The XC3090-100CB164B chip model is expected to have a high demand in the coming years. With its low-power, low-cost design, it is suitable for a variety of applications, such as data centers, embedded systems, and aerospace applications. It is also expected to be used in a variety of other applications, such as industrial automation, medical imaging, and automotive applications.
The product description and specific design requirements of the XC3090-100CB164B chip model are outlined in the product datasheet. The datasheet provides detailed information about the chip model, including its features, performance, and power consumption. It also provides information about the development tools available for the XC3090-100CB164B chip model, as well as design guidelines and best practices.
In addition, there are a number of case studies and best practices available for the XC3090-100CB164B chip model. These case studies provide information about how the chip model has been used in various applications and how it has performed in those applications. They also provide information about design considerations and precautions to take when working with the chip model.
In terms of the industry trends of the XC3090-100CB164B chip model and the future development of related industries, it is difficult to predict what specific technologies will be needed. However, it is clear that the XC3090-100CB164B chip model is a versatile and cost-effective solution for a variety of applications. It is also expected to be in high demand in the coming years, as it is suitable for a variety of applications and offers a low-power, low-cost design. With the wide range of development tools available, as well as the case studies and best practices available, it is likely that the XC3090-100CB164B chip model will continue to be a popular choice for many applications.
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