XC3090-100CB164B
XC3090-100CB164B
Image shown is a representation only, Exact specifications should be obtained from the product data sheet.
rohs

AMD Xilinx

XC3090-100CB164B


XC3090-100CB164B
F20-XC3090-100CB164B
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, GQFF, TAPEPAK,164P,.025
GQFF, TAPEPAK,164P,.025

XC3090-100CB164B ECAD Model


Download the free Library Loader to convert this file for your ECAD Tool. Learn more about ECAD Model.

XC3090-100CB164B Attributes


Type Description Select
Rohs Code No
Part Life Cycle Code Obsolete
Supply Voltage-Nom 5 V
Number of Inputs 142
Number of Outputs 142
Number of Logic Cells 320
Number of Equivalent Gates 5000
Number of CLBs 320
Combinatorial Delay of a CLB-Max 7 ns
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Screening Level MIL-STD-883 Class B
Temperature Grade MILITARY
Package Shape SQUARE
Technology CMOS
Organization 320 CLBS, 5000 GATES
Additional Feature 928 FLIP-FLOPS; TYP. GATES = 5000-6000; POWER-DOWN SUPPLY CURRENT = 250UA
Clock Frequency-Max 100 MHz
Power Supplies 5 V
JESD-30 Code S-CQFP-F164
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 1
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Number of Terminals 164
Package Body Material CERAMIC, METAL-SEALED COFIRED
Package Code GQFF
Package Equivalence Code TAPEPAK,164P,.025
Package Shape SQUARE
Package Style FLATPACK, GUARD RING
Surface Mount YES
Terminal Finish TIN LEAD
Terminal Form FLAT
Terminal Pitch 650 µm
Terminal Position QUAD
Width 28.702 mm
Length 28.702 mm
Seated Height-Max 3.302 mm
Ihs Manufacturer XILINX INC
Part Package Code QFP
Package Description GQFF, TAPEPAK,164P,.025
Pin Count 164
Reach Compliance Code unknown
ECCN Code 3A001.A.2.C
HTS Code 8542.39.00.01

XC3090-100CB164B Datasheet Download


XC3090-100CB164B Overview



The chip model XC3090-100CB164B is a new technology developed by the semiconductor company Xilinx. It is a high-performance, low-power, and cost-effective Field Programmable Gate Array (FPGA). This chip model is designed to meet the needs of a wide range of applications, including data centers, embedded systems, and aerospace applications.


The XC3090-100CB164B chip model offers a variety of advantages. It has a large number of configurable logic blocks, a high-speed transceiver, and a wide range of I/O capabilities. It also has a low-power, low-cost design, making it suitable for a variety of applications. The chip model also supports a wide range of development tools, including the Vivado Design Suite, which provides a comprehensive set of development tools for the FPGA.


The XC3090-100CB164B chip model is expected to have a high demand in the coming years. With its low-power, low-cost design, it is suitable for a variety of applications, such as data centers, embedded systems, and aerospace applications. It is also expected to be used in a variety of other applications, such as industrial automation, medical imaging, and automotive applications.


The product description and specific design requirements of the XC3090-100CB164B chip model are outlined in the product datasheet. The datasheet provides detailed information about the chip model, including its features, performance, and power consumption. It also provides information about the development tools available for the XC3090-100CB164B chip model, as well as design guidelines and best practices.


In addition, there are a number of case studies and best practices available for the XC3090-100CB164B chip model. These case studies provide information about how the chip model has been used in various applications and how it has performed in those applications. They also provide information about design considerations and precautions to take when working with the chip model.


In terms of the industry trends of the XC3090-100CB164B chip model and the future development of related industries, it is difficult to predict what specific technologies will be needed. However, it is clear that the XC3090-100CB164B chip model is a versatile and cost-effective solution for a variety of applications. It is also expected to be in high demand in the coming years, as it is suitable for a variety of applications and offers a low-power, low-cost design. With the wide range of development tools available, as well as the case studies and best practices available, it is likely that the XC3090-100CB164B chip model will continue to be a popular choice for many applications.



1,030 In Stock


I want to buy

Unit Price: N/A
paypal mastercard unionpay dhl fedex ups

Pricing (USD)

QTY Unit Price Ext Price
No reference price found.

Quick Quote