AMD Xilinx
XC3064-70PQ160I
XC3064-70PQ160I ECAD Model
XC3064-70PQ160I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 120 | |
| Number of Outputs | 120 | |
| Number of Logic Cells | 224 | |
| Number of Equivalent Gates | 3500 | |
| Number of CLBs | 224 | |
| Combinatorial Delay of a CLB-Max | 9 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 224 CLBS, 3500 GATES | |
| Additional Feature | 688 FLIP-FLOPS; TYP. GATES = 3500-4500; POWER-DOWN SUPPLY CURRENT = 170UA | |
| Clock Frequency-Max | 70 MHz | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.5 V | |
| Supply Voltage-Min | 4.5 V | |
| JESD-30 Code | S-PQFP-G160 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 160 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | QFP | |
| Package Equivalence Code | QFP160,1.2SQ | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 650 µm | |
| Terminal Position | QUAD | |
| Width | 28 mm | |
| Length | 28 mm | |
| Seated Height-Max | 3.92 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | QFP, QFP160,1.2SQ | |
| Pin Count | 160 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC3064-70PQ160I Datasheet Download
XC3064-70PQ160I Overview
The XC3064-70PQ160I chip model is a high-performance programmable logic device (PLD) designed by Xilinx. It is a powerful device that offers a wide range of features and capabilities. Its original design intention was to provide a platform for the development of complex and sophisticated digital systems. It is capable of being used in a variety of applications, including communications, networking, and artificial intelligence.
The chip model is equipped with a large number of programmable logic elements (LEs), which makes it suitable for a wide range of applications. It also has a wide range of I/O and clock resources, allowing it to be used in a variety of communication systems. In addition, it has a wide range of memory resources, allowing it to be used in advanced communications systems.
The XC3064-70PQ160I chip model is designed to be used in a variety of communication networks, such as cellular, wireless, and satellite networks. It is also capable of being used in advanced communication systems, such as those used in the Internet of Things (IoT). In addition, it is capable of being used in intelligent scenarios, such as those used in smart cities, autonomous vehicles, and industrial automation.
The product description of the XC3064-70PQ160I chip model states that it is a high-performance programmable logic device designed to provide a platform for the development of complex and sophisticated digital systems. It is equipped with a large number of programmable logic elements, allowing it to be used in a variety of applications. It also has a wide range of I/O and clock resources, allowing it to be used in a variety of communication systems. In addition, it has a wide range of memory resources, allowing it to be used in advanced communications systems.
The design requirements of the XC3064-70PQ160I chip model include a wide range of features and capabilities. It is designed to be used in a variety of communication networks, such as cellular, wireless, and satellite networks. It is also capable of being used in advanced communication systems, such as those used in the Internet of Things (IoT). In addition, it is capable of being used in intelligent scenarios, such as those used in smart cities, autonomous vehicles, and industrial automation.
The XC3064-70PQ160I chip model has been used in a variety of case studies, including the development of an intelligent traffic system, an autonomous vehicle, and a smart home system. In each case, the chip model was able to provide the necessary capabilities and features to enable the successful implementation of the system.
When using the XC3064-70PQ160I chip model, it is important to ensure that the device is properly configured and programmed. It is also important to ensure that the device is used in accordance with the manufacturer’s specifications and guidelines. Additionally, it is important to ensure that the device is used in an environment that is free from electromagnetic interference.
In conclusion, the XC3064-70PQ160I chip model is a powerful device that offers a wide range of features and capabilities. Its original design intention was to provide a platform for the development of complex and sophisticated digital systems. It is capable of being used in a variety of applications, including communications, networking, and artificial intelligence. It is also capable of being used in a variety of communication networks, such as cellular, wireless, and satellite networks. In addition, it is capable of being used in advanced communication systems, such as those used in the Internet of Things (IoT). Finally, it is capable of being used in intelligent scenarios, such as those used in smart cities, autonomous vehicles, and industrial automation.
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3,993 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $23.2500 | $23.2500 |
| 10+ | $23.0000 | $230.0000 |
| 100+ | $21.7500 | $2,175.0000 |
| 1000+ | $20.5000 | $10,250.0000 |
| 10000+ | $18.7500 | $18,750.0000 |
| The price is for reference only, please refer to the actual quotation! | ||