AMD Xilinx
XC3064-70PQ160C
XC3064-70PQ160C ECAD Model
XC3064-70PQ160C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 120 | |
| Number of Outputs | 120 | |
| Number of Logic Cells | 224 | |
| Number of Equivalent Gates | 3500 | |
| Number of CLBs | 224 | |
| Combinatorial Delay of a CLB-Max | 9 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 224 CLBS, 3500 GATES | |
| Additional Feature | 688 FLIP-FLOPS; TYP. GATES = 3500-4500; POWER-DOWN SUPPLY CURRENT = 170UA | |
| Clock Frequency-Max | 70 MHz | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.25 V | |
| Supply Voltage-Min | 4.75 V | |
| JESD-30 Code | S-PQFP-G160 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 160 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | QFP | |
| Package Equivalence Code | QFP160,1.2SQ | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 650 µm | |
| Terminal Position | QUAD | |
| Width | 28 mm | |
| Length | 28 mm | |
| Seated Height-Max | 3.92 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | QFP, QFP160,1.2SQ | |
| Pin Count | 160 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC3064-70PQ160C Datasheet Download
XC3064-70PQ160C Overview
The chip model XC3064-70PQ160C is a powerful and reliable integrated circuit that has been developed to meet the needs of the modern digital world. It is a versatile and powerful chip that can be used in a variety of applications, including digital signal processing, artificial intelligence, robotics, and more.
The XC3064-70PQ160C chip model is considered one of the most advanced chips on the market today. It is designed to provide a high-performance, low-power solution for a variety of applications. The chip is capable of providing a wide range of features, such as high-speed data processing, high-speed memory access, low-power operation, and more.
The XC3064-70PQ160C chip model has been designed to meet the needs of the modern digital world. It is capable of providing a wide range of features, including high-speed data processing, high-speed memory access, low-power operation, and more. This chip model is also designed to be compatible with a variety of operating systems, including Windows, Mac OS, and Linux.
The industry trends for the chip model XC3064-70PQ160C are constantly evolving. As new technologies emerge, the chip model will need to be updated in order to keep up with the latest advancements. In addition, the chip model must be able to support the application environment in order to ensure that it is able to provide the best performance possible.
The XC3064-70PQ160C chip model has also been designed to be used in the development and popularization of future intelligent robots. This chip model is capable of providing a wide range of features, including high-speed data processing, high-speed memory access, low-power operation, and more. In order to use the chip model effectively, it is important to have the right technical talent in place to ensure that the chip model is able to perform as expected.
In order to get the most out of the XC3064-70PQ160C chip model, it is important to understand the product description and specific design requirements. It is also important to understand the actual case studies and precautions that should be taken when using the chip model. By understanding the product description, design requirements, case studies, and precautions, it will be easier to ensure that the chip model is able to perform as expected.
In conclusion, the XC3064-70PQ160C chip model is a powerful and reliable integrated circuit that has been designed to meet the needs of the modern digital world. It is capable of providing a wide range of features, including high-speed data processing, high-speed memory access, low-power operation, and more. The industry trends for the chip model are constantly evolving, and it is important to understand the product description, design requirements, case studies, and precautions in order to get the most out of the chip model. In addition, the chip model is capable of being used in the development and popularization of future intelligent robots, and it is important to have the right technical talent in place to ensure that the chip model is able to perform as expected.
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5,329 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $40.1760 | $40.1760 |
| 10+ | $39.7440 | $397.4400 |
| 100+ | $37.5840 | $3,758.4000 |
| 1000+ | $35.4240 | $17,712.0000 |
| 10000+ | $32.4000 | $32,400.0000 |
| The price is for reference only, please refer to the actual quotation! | ||