XC3064-70PP132C
XC3064-70PP132C
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rohs

AMD Xilinx

XC3064-70PP132C


XC3064-70PP132C
F20-XC3064-70PP132C
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, PGA, PGA132,14X14
PGA, PGA132,14X14

XC3064-70PP132C ECAD Model


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XC3064-70PP132C Attributes


Type Description Select
Rohs Code No
Part Life Cycle Code Obsolete
Supply Voltage-Nom 5 V
Number of Inputs 110
Number of Outputs 110
Number of Logic Cells 224
Number of Equivalent Gates 3500
Number of CLBs 224
Combinatorial Delay of a CLB-Max 9 ns
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology CMOS
Organization 224 CLBS, 3500 GATES
Additional Feature 688 FLIP-FLOPS; TYP. GATES = 3500-4500; POWER-DOWN SUPPLY CURRENT = 170UA
Clock Frequency-Max 70 MHz
Power Supplies 5 V
Supply Voltage-Max 5.25 V
Supply Voltage-Min 4.75 V
JESD-30 Code S-PPGA-P132
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 1
Operating Temperature-Max 85 °C
Number of Terminals 132
Package Body Material PLASTIC/EPOXY
Package Code PGA
Package Equivalence Code PGA132,14X14
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount NO
Terminal Finish TIN LEAD
Terminal Form PIN/PEG
Terminal Pitch 2.54 mm
Terminal Position PERPENDICULAR
Width 37.084 mm
Length 37.084 mm
Seated Height-Max 3.7338 mm
Ihs Manufacturer XILINX INC
Part Package Code PGA
Package Description PGA, PGA132,14X14
Pin Count 132
Reach Compliance Code unknown
HTS Code 8542.39.00.01

XC3064-70PP132C Datasheet Download


XC3064-70PP132C Overview



The XC3064-70PP132C chip model is a powerful tool for high-performance digital signal processing, embedded processing, and image processing. It is designed to be used with the HDL language, making it an ideal choice for a range of applications.


The XC3064-70PP132C chip model is at the forefront of industry trends and is expected to be a key component in the development of future technologies. It could be used in networks, allowing for intelligent applications and scenarios. It can also be used in fully intelligent systems, allowing for a more efficient use of resources.


The XC3064-70PP132C chip model is a versatile tool that can be used in a range of different applications. It is designed to be used with HDL language, making it a powerful tool for digital signal processing, embedded processing, and image processing.


The XC3064-70PP132C chip model is expected to be a crucial component in the development of future technologies. It can be used in networks to create intelligent applications and scenarios. It can also be used in fully intelligent systems, allowing for a more efficient use of resources.


The XC3064-70PP132C chip model is an ideal choice for a range of applications, from digital signal processing to embedded processing and image processing. It is designed to be used with the HDL language, making it a powerful tool for a variety of applications.


The XC3064-70PP132C chip model is at the forefront of industry trends and is expected to be a key component in the development of future technologies. It can be used in networks to create intelligent applications and scenarios. It can also be used in fully intelligent systems, allowing for a more efficient use of resources. It is an ideal choice for a range of applications and is expected to play a major role in the future of the industry.


The XC3064-70PP132C chip model is a powerful tool for high-performance digital signal processing, embedded processing, and image processing. It is designed to be used with the HDL language, making it an ideal choice for a range of applications. It is at the forefront of industry trends and is expected to be a key component in the development of future technologies. It can be used in networks to create intelligent applications and scenarios. It can also be used in fully intelligent systems, allowing for a more efficient use of resources. It is an ideal choice for a range of applications and is expected to play a major role in the future of the industry.



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