
AMD Xilinx
XC3064-70PP132C
XC3064-70PP132C ECAD Model
XC3064-70PP132C Attributes
Type | Description | Select |
---|---|---|
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 5 V | |
Number of Inputs | 110 | |
Number of Outputs | 110 | |
Number of Logic Cells | 224 | |
Number of Equivalent Gates | 3500 | |
Number of CLBs | 224 | |
Combinatorial Delay of a CLB-Max | 9 ns | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 224 CLBS, 3500 GATES | |
Additional Feature | 688 FLIP-FLOPS; TYP. GATES = 3500-4500; POWER-DOWN SUPPLY CURRENT = 170UA | |
Clock Frequency-Max | 70 MHz | |
Power Supplies | 5 V | |
Supply Voltage-Max | 5.25 V | |
Supply Voltage-Min | 4.75 V | |
JESD-30 Code | S-PPGA-P132 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 1 | |
Operating Temperature-Max | 85 °C | |
Number of Terminals | 132 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | PGA | |
Package Equivalence Code | PGA132,14X14 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | NO | |
Terminal Finish | TIN LEAD | |
Terminal Form | PIN/PEG | |
Terminal Pitch | 2.54 mm | |
Terminal Position | PERPENDICULAR | |
Width | 37.084 mm | |
Length | 37.084 mm | |
Seated Height-Max | 3.7338 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | PGA | |
Package Description | PGA, PGA132,14X14 | |
Pin Count | 132 | |
Reach Compliance Code | unknown | |
HTS Code | 8542.39.00.01 |
XC3064-70PP132C Datasheet Download
XC3064-70PP132C Overview
The XC3064-70PP132C chip model is a powerful tool for high-performance digital signal processing, embedded processing, and image processing. It is designed to be used with the HDL language, making it an ideal choice for a range of applications.
The XC3064-70PP132C chip model is at the forefront of industry trends and is expected to be a key component in the development of future technologies. It could be used in networks, allowing for intelligent applications and scenarios. It can also be used in fully intelligent systems, allowing for a more efficient use of resources.
The XC3064-70PP132C chip model is a versatile tool that can be used in a range of different applications. It is designed to be used with HDL language, making it a powerful tool for digital signal processing, embedded processing, and image processing.
The XC3064-70PP132C chip model is expected to be a crucial component in the development of future technologies. It can be used in networks to create intelligent applications and scenarios. It can also be used in fully intelligent systems, allowing for a more efficient use of resources.
The XC3064-70PP132C chip model is an ideal choice for a range of applications, from digital signal processing to embedded processing and image processing. It is designed to be used with the HDL language, making it a powerful tool for a variety of applications.
The XC3064-70PP132C chip model is at the forefront of industry trends and is expected to be a key component in the development of future technologies. It can be used in networks to create intelligent applications and scenarios. It can also be used in fully intelligent systems, allowing for a more efficient use of resources. It is an ideal choice for a range of applications and is expected to play a major role in the future of the industry.
The XC3064-70PP132C chip model is a powerful tool for high-performance digital signal processing, embedded processing, and image processing. It is designed to be used with the HDL language, making it an ideal choice for a range of applications. It is at the forefront of industry trends and is expected to be a key component in the development of future technologies. It can be used in networks to create intelligent applications and scenarios. It can also be used in fully intelligent systems, allowing for a more efficient use of resources. It is an ideal choice for a range of applications and is expected to play a major role in the future of the industry.
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