AMD Xilinx
XC3064-70PG132M
XC3064-70PG132M ECAD Model
XC3064-70PG132M Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 110 | |
| Number of Outputs | 110 | |
| Number of Logic Cells | 224 | |
| Number of Equivalent Gates | 3500 | |
| Number of CLBs | 224 | |
| Combinatorial Delay of a CLB-Max | 9 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | MILITARY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 224 CLBS, 3500 GATES | |
| Additional Feature | 688 FLIP-FLOPS; TYP. GATES = 3500-4500; POWER-DOWN SUPPLY CURRENT = 170UA | |
| Clock Frequency-Max | 70 MHz | |
| Power Supplies | 5 V | |
| JESD-30 Code | S-CPGA-P132 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e3 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Number of Terminals | 132 | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | PGA | |
| Package Equivalence Code | PGA132,14X14 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | NO | |
| Terminal Finish | MATTE TIN | |
| Terminal Form | PIN/PEG | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | PERPENDICULAR | |
| Width | 37.084 mm | |
| Length | 37.084 mm | |
| Seated Height-Max | 3.9116 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | PGA | |
| Package Description | PGA, PGA132,14X14 | |
| Pin Count | 132 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A001.A.2.C | |
| HTS Code | 8542.39.00.01 |
XC3064-70PG132M Datasheet Download
XC3064-70PG132M Overview
The chip model XC3064-70PG132M is a highly advanced and powerful processor designed to meet the needs of modern communication systems. It is a single-chip, 32-bit microcontroller with a wide range of features and capabilities. It is capable of handling complex tasks such as digital signal processing, real-time control, and data communication.
In terms of industry trends, the XC3064-70PG132M is a reliable and efficient solution for a wide range of applications, including automotive, industrial, and consumer electronics. It is also suitable for use in a variety of communication systems, such as cellular, Wi-Fi, and Bluetooth. The chip model has been designed with the future in mind, and is capable of being upgraded with new technologies and features.
The XC3064-70PG132M has been designed to meet a variety of specific design requirements. It has a wide range of features and functions, including a 32-bit RISC core, an integrated memory controller, a wide range of peripherals, and an integrated power management unit. It is also capable of supporting a variety of communication protocols, including CAN, Ethernet, and USB.
In terms of actual case studies, the XC3064-70PG132M has been used in a variety of applications, such as automotive engine control, industrial control systems, and consumer electronics. In each case, the chip model has been able to meet the specific requirements of the application, and has been reliable and efficient in operation.
Finally, when using the XC3064-70PG132M, it is important to take certain precautions. For example, it is important to ensure that the chip is adequately cooled, as it can become damaged if it is exposed to excessive heat. Additionally, it is important to ensure that the chip is properly programmed, as incorrect programming can lead to unpredictable results.
In conclusion, the XC3064-70PG132M is a powerful and reliable processor that is suitable for a wide range of applications. It is capable of being upgraded with new technologies and features, and is capable of meeting a variety of specific design requirements. With proper care and maintenance, the chip model can provide reliable and efficient operation for a variety of applications.
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| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||