AMD Xilinx
XC3064-70PG132I
XC3064-70PG132I ECAD Model
XC3064-70PG132I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 110 | |
| Number of Outputs | 110 | |
| Number of Logic Cells | 224 | |
| Number of Equivalent Gates | 3500 | |
| Number of CLBs | 224 | |
| Combinatorial Delay of a CLB-Max | 9 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 224 CLBS, 3500 GATES | |
| Additional Feature | 688 FLIP-FLOPS; TYP. GATES = 3500-4500; POWER-DOWN SUPPLY CURRENT = 170UA | |
| Clock Frequency-Max | 70 MHz | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.5 V | |
| Supply Voltage-Min | 4.5 V | |
| JESD-30 Code | S-CPGA-P132 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Number of Terminals | 132 | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | PGA | |
| Package Equivalence Code | PGA132,14X14 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | NO | |
| Terminal Form | PIN/PEG | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | PERPENDICULAR | |
| Width | 37.084 mm | |
| Length | 37.084 mm | |
| Seated Height-Max | 3.9116 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | PGA | |
| Package Description | PGA, PGA132,14X14 | |
| Pin Count | 132 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 |
XC3064-70PG132I Datasheet Download
XC3064-70PG132I Overview
The chip model XC3064-70PG132I is an integrated circuit that is commonly used in a variety of industries. It is designed to provide a high level of performance and reliability, while also being able to fit into a wide range of applications. This chip model is capable of providing a wide range of features and functions, including high-speed data transfer, low power consumption, and cost-effectiveness.
The chip model XC3064-70PG132I is designed to provide a high level of performance and reliability, while also being able to fit into a wide range of applications. This chip model is capable of providing a wide range of features and functions, including high-speed data transfer, low power consumption, and cost-effectiveness. It is also designed to be flexible and scalable, allowing for easy customization and integration into existing systems.
In terms of industry trends, the chip model XC3064-70PG132I is expected to remain popular in the near future, due to its versatility and reliability. It is also expected to be increasingly used in the automotive, medical, and industrial sectors, as these industries require more sophisticated technology. Additionally, this chip model is expected to be used in the emerging Internet of Things (IoT) market, as it is capable of providing fast and reliable data transfer and low power consumption.
When it comes to the product description and specific design requirements of the chip model XC3064-70PG132I, it is designed to provide a wide range of features and functions, including high-speed data transfer, low power consumption, and cost-effectiveness. Additionally, the chip model is designed to be flexible and scalable, allowing for easy customization and integration into existing systems. It also has a wide range of input and output options, making it suitable for a variety of applications.
In terms of actual case studies and precautions, the chip model XC3064-70PG132I has been tested in a variety of applications, including automotive, medical, and industrial applications. In these applications, the chip model has been found to provide reliable performance and low power consumption. Additionally, the chip model has been found to be easy to customize and integrate into existing systems. However, when using this chip model, it is important to consider the specific design requirements of the application and the environment in which it will be used, as this can affect the performance of the chip model.
Overall, the chip model XC3064-70PG132I is an integrated circuit that is designed to provide a high level of performance and reliability. It is expected to remain popular in the near future, due to its versatility and reliability, and is expected to be increasingly used in the automotive, medical, and industrial sectors. Additionally, it is designed to be flexible and scalable, allowing for easy customization and integration into existing systems. When using this chip model, it is important to consider the specific design requirements of the application and the environment in which it will be used, as this can affect the performance of the chip model.
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| QTY | Unit Price | Ext Price |
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