
AMD Xilinx
XC3064-70PG132C
XC3064-70PG132C ECAD Model
XC3064-70PG132C Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 5 V | |
Number of Inputs | 110 | |
Number of Outputs | 110 | |
Number of Logic Cells | 224 | |
Number of Equivalent Gates | 3500 | |
Number of CLBs | 224 | |
Combinatorial Delay of a CLB-Max | 9 ns | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 224 CLBS, 3500 GATES | |
Additional Feature | 688 FLIP-FLOPS; TYP. GATES = 3500-4500; POWER-DOWN SUPPLY CURRENT = 170UA | |
Clock Frequency-Max | 70 MHz | |
Power Supplies | 5 V | |
Supply Voltage-Max | 5.25 V | |
Supply Voltage-Min | 4.75 V | |
JESD-30 Code | S-CPGA-P132 | |
Qualification Status | Not Qualified | |
Operating Temperature-Max | 85 °C | |
Number of Terminals | 132 | |
Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
Package Code | PGA | |
Package Equivalence Code | PGA132,14X14 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | NO | |
Terminal Form | PIN/PEG | |
Terminal Pitch | 2.54 mm | |
Terminal Position | PERPENDICULAR | |
Width | 37.084 mm | |
Length | 37.084 mm | |
Seated Height-Max | 3.9116 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | PGA | |
Package Description | PGA, PGA132,14X14 | |
Pin Count | 132 | |
Reach Compliance Code | unknown | |
HTS Code | 8542.39.00.01 |
XC3064-70PG132C Datasheet Download
XC3064-70PG132C Overview
The XC3064-70PG132C chip model is a product developed by Xilinx, Inc. It is a high-performance, low-power FPGA (Field Programmable Gate Array) device that supports a wide range of applications. The XC3064-70PG132C chip model is designed to meet the needs of embedded systems, such as industrial, medical, and automotive applications. It offers a variety of features, including high-speed transceivers, high-speed memory and logic, and high-performance processing.
The XC3064-70PG132C chip model is based on the Xilinx Virtex-6 FPGA architecture. It is equipped with the latest technologies, such as the 6th generation transceiver technology, the highest speed memory and logic, and the highest performance processing. It also supports advanced communication systems, such as PCIe, 10G Ethernet, and USB 3.0. The XC3064-70PG132C chip model is designed to provide users with a high level of performance, power efficiency, and flexibility.
The XC3064-70PG132C chip model is expected to be in high demand in the near future, due to its high performance, low power consumption, and advanced features. With its wide range of applications, it is expected to be used in many industries, such as automotive, industrial, medical, and consumer electronics. It is also expected to be used in many advanced communication systems, such as 5G, IoT, and cloud computing.
The original design intention of the XC3064-70PG132C chip model was to provide users with a high level of performance, power efficiency, and flexibility. It is also designed to be upgradable, allowing users to easily upgrade the chip model to meet their changing needs. It is also designed to be compatible with advanced communication systems, such as 5G, IoT, and cloud computing.
In conclusion, the XC3064-70PG132C chip model is designed to meet the needs of embedded systems, such as industrial, medical, and automotive applications. It offers a variety of features, including high-speed transceivers, high-speed memory and logic, and high-performance processing. It is expected to be in high demand in the near future, due to its high performance, low power consumption, and advanced features. It is also designed to be upgradable and compatible with advanced communication systems. Therefore, it is likely that the application environment will require the support of new technologies in the future.
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