XC3064-70PG132C
XC3064-70PG132C
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rohs

AMD Xilinx

XC3064-70PG132C


XC3064-70PG132C
F20-XC3064-70PG132C
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, PGA, PGA132,14X14
PGA, PGA132,14X14

XC3064-70PG132C ECAD Model


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XC3064-70PG132C Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Obsolete
Supply Voltage-Nom 5 V
Number of Inputs 110
Number of Outputs 110
Number of Logic Cells 224
Number of Equivalent Gates 3500
Number of CLBs 224
Combinatorial Delay of a CLB-Max 9 ns
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology CMOS
Organization 224 CLBS, 3500 GATES
Additional Feature 688 FLIP-FLOPS; TYP. GATES = 3500-4500; POWER-DOWN SUPPLY CURRENT = 170UA
Clock Frequency-Max 70 MHz
Power Supplies 5 V
Supply Voltage-Max 5.25 V
Supply Voltage-Min 4.75 V
JESD-30 Code S-CPGA-P132
Qualification Status Not Qualified
Operating Temperature-Max 85 °C
Number of Terminals 132
Package Body Material CERAMIC, METAL-SEALED COFIRED
Package Code PGA
Package Equivalence Code PGA132,14X14
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount NO
Terminal Form PIN/PEG
Terminal Pitch 2.54 mm
Terminal Position PERPENDICULAR
Width 37.084 mm
Length 37.084 mm
Seated Height-Max 3.9116 mm
Ihs Manufacturer XILINX INC
Part Package Code PGA
Package Description PGA, PGA132,14X14
Pin Count 132
Reach Compliance Code unknown
HTS Code 8542.39.00.01

XC3064-70PG132C Datasheet Download


XC3064-70PG132C Overview



The XC3064-70PG132C chip model is a product developed by Xilinx, Inc. It is a high-performance, low-power FPGA (Field Programmable Gate Array) device that supports a wide range of applications. The XC3064-70PG132C chip model is designed to meet the needs of embedded systems, such as industrial, medical, and automotive applications. It offers a variety of features, including high-speed transceivers, high-speed memory and logic, and high-performance processing.


The XC3064-70PG132C chip model is based on the Xilinx Virtex-6 FPGA architecture. It is equipped with the latest technologies, such as the 6th generation transceiver technology, the highest speed memory and logic, and the highest performance processing. It also supports advanced communication systems, such as PCIe, 10G Ethernet, and USB 3.0. The XC3064-70PG132C chip model is designed to provide users with a high level of performance, power efficiency, and flexibility.


The XC3064-70PG132C chip model is expected to be in high demand in the near future, due to its high performance, low power consumption, and advanced features. With its wide range of applications, it is expected to be used in many industries, such as automotive, industrial, medical, and consumer electronics. It is also expected to be used in many advanced communication systems, such as 5G, IoT, and cloud computing.


The original design intention of the XC3064-70PG132C chip model was to provide users with a high level of performance, power efficiency, and flexibility. It is also designed to be upgradable, allowing users to easily upgrade the chip model to meet their changing needs. It is also designed to be compatible with advanced communication systems, such as 5G, IoT, and cloud computing.


In conclusion, the XC3064-70PG132C chip model is designed to meet the needs of embedded systems, such as industrial, medical, and automotive applications. It offers a variety of features, including high-speed transceivers, high-speed memory and logic, and high-performance processing. It is expected to be in high demand in the near future, due to its high performance, low power consumption, and advanced features. It is also designed to be upgradable and compatible with advanced communication systems. Therefore, it is likely that the application environment will require the support of new technologies in the future.



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