
AMD Xilinx
XC3064-50PG132M
XC3064-50PG132M ECAD Model
XC3064-50PG132M Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 5 V | |
Number of Inputs | 110 | |
Number of Outputs | 110 | |
Number of Logic Cells | 224 | |
Number of Equivalent Gates | 3500 | |
Number of CLBs | 224 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | MILITARY | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 224 CLBS, 3500 GATES | |
Additional Feature | 688 FLIP-FLOPS; TYP. GATES = 3500-4500; POWER-DOWN SUPPLY CURRENT = 170UA | |
Clock Frequency-Max | 50 MHz | |
Power Supplies | 5 V | |
JESD-30 Code | S-CPGA-P132 | |
Qualification Status | Not Qualified | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -55 °C | |
Number of Terminals | 132 | |
Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
Package Code | PGA | |
Package Equivalence Code | PGA132,14X14 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | NO | |
Terminal Form | PIN/PEG | |
Terminal Pitch | 2.54 mm | |
Terminal Position | PERPENDICULAR | |
Width | 37.084 mm | |
Length | 37.084 mm | |
Seated Height-Max | 3.9116 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | PGA | |
Package Description | PGA, PGA132,14X14 | |
Pin Count | 132 | |
Reach Compliance Code | unknown | |
HTS Code | 8542.39.00.01 | |
ECCN Code | 3A001.A.2.C |
XC3064-50PG132M Datasheet Download
XC3064-50PG132M Overview
The XC3064-50PG132M chip model is a high-performance digital signal processor that is suitable for a wide range of applications. It has the ability to process digital signals, embedded processing, and image processing, and can be programmed using the HDL language. This chip model is becoming increasingly popular for its ability to be used in networks and for intelligent scenarios.
The XC3064-50PG132M chip model is designed to be highly versatile and can be used in a wide range of applications. It has a wide range of functionalities, including a high-speed processor, high-speed memory, and a wide range of input/output interfaces. It also has a number of built-in features, such as a high-speed bus, a multi-core processor, and a high-speed memory controller.
The XC3064-50PG132M chip model is ideal for use in the era of fully intelligent systems. Its high-speed processor and memory controller make it ideal for use in the development of intelligent systems. Its wide range of input/output interfaces make it possible to connect to a range of different devices, allowing it to be used in a wide range of applications.
When designing a system using the XC3064-50PG132M chip model, it is important to consider the specific design requirements. These include the type of processor, memory, and input/output interfaces that are required. It is also important to consider the specific application requirements, such as the type of data that will be processed, the type of algorithms that will be used, and the type of hardware that will be used.
Case studies can be used to demonstrate the performance of the XC3064-50PG132M chip model. These case studies can be used to demonstrate the performance of the chip in various scenarios, such as image processing, embedded processing, and digital signal processing. These case studies can also be used to demonstrate the performance of the chip in different types of networks, such as wireless networks, cellular networks, and the Internet of Things.
When using the XC3064-50PG132M chip model, it is important to take certain precautions. It is important to ensure that the chip is properly programmed, and that the system is set up correctly. It is also important to ensure that the chip is not over-utilized, as this can lead to overheating and other problems. Additionally, it is important to ensure that the chip is used in accordance with its design specifications, as this can help to ensure that the chip continues to operate at its peak performance.
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