AMD Xilinx
XC3064-100PQ160I
XC3064-100PQ160I ECAD Model
XC3064-100PQ160I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 120 | |
| Number of Outputs | 120 | |
| Number of Logic Cells | 224 | |
| Number of Equivalent Gates | 3500 | |
| Number of CLBs | 224 | |
| Combinatorial Delay of a CLB-Max | 7 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 224 CLBS, 3500 GATES | |
| Additional Feature | 688 FLIP-FLOPS; TYP. GATES = 3500-4500; POWER-DOWN SUPPLY CURRENT = 170UA | |
| Clock Frequency-Max | 100 MHz | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.5 V | |
| Supply Voltage-Min | 4.5 V | |
| JESD-30 Code | S-PQFP-G160 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 160 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | QFP | |
| Package Equivalence Code | QFP160,1.2SQ | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 650 µm | |
| Terminal Position | QUAD | |
| Width | 28 mm | |
| Length | 28 mm | |
| Seated Height-Max | 3.92 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | QFP, QFP160,1.2SQ | |
| Pin Count | 160 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC3064-100PQ160I Datasheet Download
XC3064-100PQ160I Overview
The XC3064-100PQ160I chip model is a powerful and versatile integrated circuit (IC) designed to support a wide range of applications. It is a member of the XC3000 family of programmable logic devices (PLDs) manufactured by Xilinx, Inc. The XC3064-100PQ160I is an ideal choice for designers who need to integrate complex logic functions into their designs.
The XC3064-100PQ160I chip model offers several advantages over traditional PLDs. It provides a high level of integration, allowing multiple logic functions to be implemented in a single device. It also features a high-speed architecture and low power consumption, making it suitable for applications that require fast response times and low power consumption.
In terms of industry trends, the XC3064-100PQ160I chip model is expected to remain popular in the coming years. Its versatility and high level of integration make it an ideal choice for a wide range of applications, including those in the automotive, industrial, and consumer electronics sectors. As the demand for complex logic functions increases, the XC3064-100PQ160I chip model is expected to remain an attractive option for designers.
The original design intention of the XC3064-100PQ160I chip model was to provide a high level of integration and performance in a single device. It features a wide range of logic functions and a high-speed architecture, making it suitable for a variety of applications. In addition, the chip model is designed to be easily upgradable, allowing designers to easily incorporate new technologies into their designs.
In terms of future development, the XC3064-100PQ160I chip model is expected to remain an attractive option for designers. Its versatility and high level of integration make it an ideal choice for a wide range of applications. As the demand for advanced communication systems increases, the XC3064-100PQ160I chip model may be able to provide the necessary support.
Overall, the XC3064-100PQ160I chip model is a powerful and versatile integrated circuit designed to support a wide range of applications. Its high level of integration, low power consumption, and upgradability make it an ideal choice for designers who need to integrate complex logic functions into their designs. As the demand for advanced communication systems increases, the XC3064-100PQ160I chip model may be able to provide the necessary support.
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| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||