
AMD Xilinx
XC3064-100PG132I
XC3064-100PG132I ECAD Model
XC3064-100PG132I Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 5 V | |
Number of Inputs | 110 | |
Number of Outputs | 110 | |
Number of Logic Cells | 224 | |
Number of Equivalent Gates | 3500 | |
Number of CLBs | 224 | |
Combinatorial Delay of a CLB-Max | 7 ns | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | INDUSTRIAL | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 224 CLBS, 3500 GATES | |
Additional Feature | 688 FLIP-FLOPS; TYP. GATES = 3500-4500; POWER-DOWN SUPPLY CURRENT = 170UA | |
Clock Frequency-Max | 100 MHz | |
Power Supplies | 5 V | |
Supply Voltage-Max | 5.5 V | |
Supply Voltage-Min | 4.5 V | |
JESD-30 Code | S-CPGA-P132 | |
Qualification Status | Not Qualified | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Number of Terminals | 132 | |
Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
Package Code | PGA | |
Package Equivalence Code | PGA132,14X14 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | NO | |
Terminal Form | PIN/PEG | |
Terminal Pitch | 2.54 mm | |
Terminal Position | PERPENDICULAR | |
Width | 37.084 mm | |
Length | 37.084 mm | |
Seated Height-Max | 3.9116 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | PGA | |
Package Description | PGA, PGA132,14X14 | |
Pin Count | 132 | |
Reach Compliance Code | unknown | |
HTS Code | 8542.39.00.01 |
XC3064-100PG132I Datasheet Download
XC3064-100PG132I Overview
The XC3064-100PG132I is a cutting-edge chip model that is suitable for a variety of applications, such as high-performance digital signal processing, embedded processing, and image processing. It is designed to be programmed in a Hardware Description Language (HDL) and provides an impressive amount of performance and features.
The XC3064-100PG132I is an excellent choice for a variety of industries, including telecommunications, automotive, medical, industrial, and consumer electronics. It is designed to be highly configurable and can be used to create a wide variety of products. For example, it can be used to create high-performance digital signal processing systems, embedded processing systems, and image processing systems.
In terms of industry trends, the XC3064-100PG132I is designed to be highly compatible with existing technologies. This allows it to be used in a wide range of applications without the need for new technologies. However, if new technologies are needed, the XC3064-100PG132I can be adapted to meet the needs of the application.
When designing a product that uses the XC3064-100PG132I, it is important to consider the product’s specific design requirements. This includes selecting the appropriate components, such as memory, peripherals, and other components, as well as the necessary software. Additionally, it is important to consider the specific environment in which the product will be used, such as temperature, humidity, and other environmental factors.
When using the XC3064-100PG132I, it is important to consider the product’s power consumption and heat dissipation. Additionally, it is important to consider the product’s reliability and maintainability. Finally, it is important to consider the product’s cost and the time needed for its development.
The XC3064-100PG132I is an excellent choice for a variety of applications. It is designed to be highly configurable and can be used to create a wide variety of products. Additionally, it is designed to be highly compatible with existing technologies, allowing it to be used in a wide range of applications without the need for new technologies. When designing a product that uses the XC3064-100PG132I, it is important to consider the product’s specific design requirements, as well as the product’s power consumption, heat dissipation, reliability, maintainability, cost, and development time.
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