AMD Xilinx
XC3042A-7PP132C
XC3042A-7PP132C ECAD Model
XC3042A-7PP132C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 96 | |
| Number of Outputs | 96 | |
| Number of Logic Cells | 144 | |
| Number of Equivalent Gates | 2000 | |
| Number of CLBs | 144 | |
| Combinatorial Delay of a CLB-Max | 5.1 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 144 CLBS, 2000 GATES | |
| Additional Feature | TYP. GATES = 2000-3000 | |
| Clock Frequency-Max | 113 MHz | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.25 V | |
| Supply Voltage-Min | 4.75 V | |
| JESD-30 Code | S-PPGA-P132 | |
| Qualification Status | Not Qualified | |
| Moisture Sensitivity Level | 1 | |
| Operating Temperature-Max | 85 °C | |
| Number of Terminals | 132 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | PGA | |
| Package Equivalence Code | PGA132,14X14 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | NO | |
| Terminal Form | PIN/PEG | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | PERPENDICULAR | |
| Width | 37.084 mm | |
| Length | 37.084 mm | |
| Seated Height-Max | 4.191 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | PGA | |
| Package Description | PGA, PGA132,14X14 | |
| Pin Count | 132 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 |
XC3042A-7PP132C Datasheet Download
XC3042A-7PP132C Overview
The XC3042A-7PP132C chip model is a powerful, high-performance microcontroller designed to meet the needs of advanced communication systems. It is a 32-bit microcontroller with a RISC-V architecture, and it is capable of running at up to 72MHz clock speed. It also has a wide range of peripherals, including a 12-bit ADC, a 32-bit Timer, an 8-channel DMA controller, and a 32-bit GPIO.
The XC3042A-7PP132C chip model was designed with the intention of providing a powerful, reliable, and cost-effective solution for communication systems. It is capable of supporting a wide range of communication protocols, including Ethernet, WiFi, Bluetooth, and Zigbee. It is also capable of supporting advanced applications such as voice recognition, machine learning, and artificial intelligence.
The XC3042A-7PP132C chip model has the potential to be upgraded in the future to meet the needs of more advanced communication systems. It has the potential to be used in the era of fully intelligent systems, as it is capable of supporting advanced applications such as machine learning and artificial intelligence. It can also be used in networks to provide a secure, reliable, and cost-effective solution for communication.
The product description and specific design requirements of the XC3042A-7PP132C chip model are outlined in detail in the product datasheet. It is important to read through the datasheet carefully to ensure that the chip model meets the specific requirements of the application. It is also important to pay attention to the power consumption and temperature requirements of the chip model, as these can affect the performance and reliability of the chip.
Case studies and customer reviews can provide insight into the performance of the XC3042A-7PP132C chip model in different scenarios. It is important to read through the case studies and customer reviews to gain an understanding of the performance of the chip model in different applications. It is also important to be aware of any known issues or precautions that need to be taken when using the chip model.
In conclusion, the XC3042A-7PP132C chip model is a powerful, high-performance microcontroller designed to meet the needs of advanced communication systems. It has the potential to be upgraded in the future to meet the needs of more advanced communication systems, and it can be used in networks to provide a secure, reliable, and cost-effective solution for communication. It is important to read through the product datasheet and case studies carefully to ensure that the chip model meets the specific requirements of the application, and to be aware of any known issues or precautions that need to be taken when using the chip model.
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| QTY | Unit Price | Ext Price |
|---|---|---|
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