AMD Xilinx
XC3042A-6TQ144C
XC3042A-6TQ144C ECAD Model
XC3042A-6TQ144C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 96 | |
| Number of Outputs | 96 | |
| Number of Logic Cells | 144 | |
| Number of Equivalent Gates | 2000 | |
| Number of CLBs | 144 | |
| Combinatorial Delay of a CLB-Max | 4.1 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 144 CLBS, 2000 GATES | |
| Additional Feature | MAX USABLE 3000 LOGIC GATES | |
| Clock Frequency-Max | 135 MHz | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.25 V | |
| Supply Voltage-Min | 4.75 V | |
| JESD-30 Code | S-PQFP-G144 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 144 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFQFP | |
| Package Equivalence Code | QFP144,.87SQ,20 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, LOW PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn85Pb15) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 20 mm | |
| Length | 20 mm | |
| Seated Height-Max | 1.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | LFQFP, QFP144,.87SQ,20 | |
| Pin Count | 144 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC3042A-6TQ144C Datasheet Download
XC3042A-6TQ144C Overview
The XC3042A-6TQ144C chip model is the latest in a line of high-performance digital signal processing, embedded processing, and image processing solutions. It is designed to meet the needs of a variety of applications, from consumer electronics to industrial automation. The chip model requires the use of HDL language, making it a suitable choice for those looking to develop high-performance applications.
The chip model offers a number of advantages, including high clock speeds, low power consumption, and advanced features such as multiple clock domains. These features make the chip model ideal for applications that require high performance, such as image processing, video processing, and other specialized tasks. The chip model is also designed to be compatible with a variety of development environments, making it a great choice for those who need to quickly and easily integrate it into their existing systems.
In terms of future development, the chip model is expected to remain a popular choice for applications that require high performance and low power consumption. As new technologies emerge, the chip model is likely to remain a viable solution for those who need to keep up with the latest trends. Additionally, the chip model is likely to remain a popular choice for those who need to develop applications quickly and easily. With its advanced features and compatibility with a variety of development environments, the chip model is likely to remain a popular choice for those looking for high performance, low power consumption, and easy integration into existing systems.
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1,650 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $22.3200 | $22.3200 |
| 10+ | $22.0800 | $220.8000 |
| 100+ | $20.8800 | $2,088.0000 |
| 1000+ | $19.6800 | $9,840.0000 |
| 10000+ | $18.0000 | $18,000.0000 |
| The price is for reference only, please refer to the actual quotation! | ||