AMD Xilinx
XC3042-70PQ100C
XC3042-70PQ100C ECAD Model
XC3042-70PQ100C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 82 | |
| Number of Outputs | 82 | |
| Number of Logic Cells | 144 | |
| Number of Equivalent Gates | 2000 | |
| Number of CLBs | 144 | |
| Combinatorial Delay of a CLB-Max | 9 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | RECTANGULAR | |
| Technology | CMOS | |
| Organization | 144 CLBS, 2000 GATES | |
| Additional Feature | 480 FLIP-FLOPS; TYP. GATES = 2000-3000; POWER-DOWN SUPPLY CURRENT = 120UA | |
| Clock Frequency-Max | 70 MHz | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.25 V | |
| Supply Voltage-Min | 4.75 V | |
| JESD-30 Code | R-PQFP-G100 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 100 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | QFP | |
| Package Equivalence Code | QFP100,.7X.9 | |
| Package Shape | RECTANGULAR | |
| Package Style | FLATPACK | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 650 µm | |
| Terminal Position | QUAD | |
| Width | 14 mm | |
| Length | 20 mm | |
| Seated Height-Max | 2.87 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | QFP, QFP100,.7X.9 | |
| Pin Count | 100 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC3042-70PQ100C Datasheet Download
XC3042-70PQ100C Overview
The XC3042-70PQ100C chip model is a product of the semiconductor industry, and it has been widely used in many electronic products and systems. As the demand for faster, more powerful, and more efficient electronic systems grows, the XC3042-70PQ100C chip model is becoming increasingly popular.
The XC3042-70PQ100C chip model is capable of providing high-speed data transmission and processing, as well as a wide range of features that make it suitable for use in a variety of applications. It is also capable of providing support for a wide range of technologies, such as Wi-Fi, Bluetooth, and Zigbee.
In terms of the industry trends of the XC3042-70PQ100C chip model, it is expected to be used in a wide range of applications, from consumer electronics to industrial automation and control. It is also expected to be used in the development of intelligent systems, such as robotics and artificial intelligence.
In terms of the future development of the XC3042-70PQ100C chip model, it is expected to be used in the development of intelligent networks and robots. It is also expected to be used in the development of fully intelligent systems, such as those that can be used in smart homes and factories.
In terms of the application environment, the XC3042-70PQ100C chip model is expected to be used in a wide range of applications, from consumer electronics to industrial automation and control. It is also expected to provide support for a wide range of technologies, such as Wi-Fi, Bluetooth, and Zigbee.
In terms of the technical talents needed to use the XC3042-70PQ100C chip model effectively, it is important to have a good understanding of the various technologies related to the chip, as well as the application environment in which it is used. It is also important to have a good understanding of the various programming languages and tools that are used in the development of intelligent systems.
In conclusion, the XC3042-70PQ100C chip model is expected to be used in a wide range of applications in the future, from consumer electronics to industrial automation and control. It is also expected to provide support for a wide range of technologies, such as Wi-Fi, Bluetooth, and Zigbee. In order to use the XC3042-70PQ100C chip model effectively, it is important to have a good understanding of the various technologies related to the chip, as well as the application environment in which it is used. It is also important to have a good understanding of the various programming languages and tools that are used in the development of intelligent systems.
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2,216 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $10.0440 | $10.0440 |
| 10+ | $9.9360 | $99.3600 |
| 100+ | $9.3960 | $939.6000 |
| 1000+ | $8.8560 | $4,428.0000 |
| 10000+ | $8.1000 | $8,100.0000 |
| The price is for reference only, please refer to the actual quotation! | ||