AMD Xilinx
XC3042-70PG84B
XC3042-70PG84B ECAD Model
XC3042-70PG84B Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 74 | |
| Number of Outputs | 74 | |
| Number of Logic Cells | 144 | |
| Number of Equivalent Gates | 2000 | |
| Number of CLBs | 144 | |
| Combinatorial Delay of a CLB-Max | 9 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Screening Level | MIL-STD-883 Class B | |
| Temperature Grade | MILITARY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 144 CLBS, 2000 GATES | |
| Additional Feature | 480 FLIP-FLOPS; TYP. GATES = 2000-3000; POWER-DOWN SUPPLY CURRENT = 120UA | |
| Clock Frequency-Max | 70 MHz | |
| Power Supplies | 5 V | |
| JESD-30 Code | S-CPGA-P84 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Number of Terminals | 84 | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | PGA | |
| Package Equivalence Code | PGA84M,11X11 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | NO | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | PIN/PEG | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | PERPENDICULAR | |
| Width | 27.94 mm | |
| Length | 27.94 mm | |
| Seated Height-Max | 5.207 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | PGA | |
| Package Description | PGA, PGA84M,11X11 | |
| Pin Count | 84 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | 3A001.A.2.C |
XC3042-70PG84B Datasheet Download
XC3042-70PG84B Overview
The XC3042-70PG84B chip model is a high-performance, low-power, and low-cost integrated circuit designed to meet the needs of a variety of industries. Its main advantages lie in its ability to provide a wide range of functions, including high-speed data processing, memory control, and communication. This makes it an ideal choice for a variety of applications, such as industrial automation, consumer electronics, and automotive industries.
The XC3042-70PG84B chip model is designed to meet the needs of a wide range of industries, including those in the automotive, consumer electronics, and industrial automation sectors. It is expected that demand for the chip model will continue to grow in the future, as more industries realize the benefits of using it in their products. The chip model is also designed to meet the needs of advanced communication systems, which are becoming increasingly important in the modern world.
The XC3042-70PG84B chip model is designed to meet specific design requirements. It is capable of providing high-speed data processing, memory control, and communication. It also features low power consumption and low cost, making it an ideal choice for a variety of applications. Furthermore, it is designed to be easily upgradable, allowing users to take advantage of the latest technology.
In order to ensure the best performance and reliability of the XC3042-70PG84B chip model, it is important to follow certain precautions. For instance, it is important to ensure that the chip model is installed correctly and that all the necessary steps are taken to ensure that it is properly maintained. Additionally, it is important to ensure that the chip model is compatible with the other components in the system, as this can affect performance.
Case studies of the XC3042-70PG84B chip model have been conducted in a variety of industries, including automotive, consumer electronics, and industrial automation. The results of these studies have shown that the chip model is capable of providing reliable performance, low power consumption, and low cost. Additionally, the chip model has proven to be capable of meeting the needs of advanced communication systems, making it an ideal choice for a variety of applications.
In conclusion, the XC3042-70PG84B chip model is an excellent choice for a variety of applications, including those in the automotive, consumer electronics, and industrial automation sectors. Its main advantages lie in its ability to provide high-speed data processing, memory control, and communication. Additionally, it is designed to be easily upgradable and is capable of meeting the needs of advanced communication systems. Furthermore, it is important to ensure that the chip model is installed correctly and that all the necessary steps are taken to ensure that it is properly maintained.
You May Also Be Interested In
3,371 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||