AMD Xilinx
XC3042-70PG132B
XC3042-70PG132B ECAD Model
XC3042-70PG132B Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 96 | |
| Number of Outputs | 96 | |
| Number of Logic Cells | 144 | |
| Number of Equivalent Gates | 2000 | |
| Number of CLBs | 144 | |
| Combinatorial Delay of a CLB-Max | 9 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Screening Level | MIL-STD-883 Class B | |
| Temperature Grade | MILITARY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 144 CLBS, 2000 GATES | |
| Additional Feature | 480 FLIP-FLOPS; TYP. GATES = 2000-3000; POWER-DOWN SUPPLY CURRENT = 120UA | |
| Clock Frequency-Max | 70 MHz | |
| Power Supplies | 5 V | |
| JESD-30 Code | S-CPGA-P132 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 132 | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | PGA | |
| Package Equivalence Code | PGA132,14X14 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | NO | |
| Terminal Form | PIN/PEG | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | PERPENDICULAR | |
| Width | 37.084 mm | |
| Length | 37.084 mm | |
| Seated Height-Max | 4.318 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | PGA | |
| Package Description | PGA, PGA132,14X14 | |
| Pin Count | 132 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | 3A001.A.2.C |
XC3042-70PG132B Datasheet Download
XC3042-70PG132B Overview
The XC3042-70PG132B chip model is a high-performance, low-cost, and power-efficient chip model developed by Xilinx, Inc. It is a Field Programmable Gate Array (FPGA) device that is designed for a wide range of applications including communication systems, digital signal processing, and embedded systems.
The XC3042-70PG132B chip model offers a wide range of advantages over traditional chips, such as higher performance, lower cost, and greater power efficiency. The chip model also provides a high degree of flexibility, allowing for custom programming and reconfiguration of the device. This makes it ideal for use in a variety of applications, from the most basic to the most advanced.
The chip model is designed to meet the specific requirements of communication systems, digital signal processing, and embedded systems. It has a high-speed parallel interface, a low-power operation, and a low-cost design. It also offers a wide range of features, including a wide range of I/O ports, high-speed memory, and advanced programming capabilities.
The chip model has been designed with scalability in mind, allowing for future upgrades and expansion. This makes it suitable for use in advanced communication systems, as it can be easily upgraded to meet the changing needs of the system. The chip model also offers a wide range of features, including a high-speed parallel interface, low-power operation, and a low-cost design.
The XC3042-70PG132B chip model has been designed to meet the specific requirements of communication systems, digital signal processing, and embedded systems. It is designed with a wide range of features, including a wide range of I/O ports, high-speed memory, and advanced programming capabilities. It also offers a high degree of flexibility, allowing for custom programming and reconfiguration of the device.
In terms of demand trends, the XC3042-70PG132B chip model is expected to see increased demand in the future, as more and more applications require the high-performance, low-cost, and power-efficient chip model. Additionally, the chip model's scalability and flexibility make it ideal for use in advanced communication systems, as it can be easily upgraded to meet the changing needs of the system.
When using the XC3042-70PG132B chip model, it is important to consider the specific design requirements of the application. This includes the type of I/O ports, the speed of the memory, and the programming capabilities of the device. Additionally, it is important to ensure that the chip model is properly configured and integrated into the system, as improper integration can lead to system instability or even failure.
In conclusion, the XC3042-70PG132B chip model is an ideal choice for a wide range of applications, including communication systems, digital signal processing, and embedded systems. It offers a wide range of advantages, including higher performance, lower cost, and greater power efficiency. Additionally, the chip model is designed with scalability in mind, allowing for future upgrades and expansion. This makes it suitable for use in advanced communication systems, as it can be easily upgraded to meet the changing needs of the system. As demand for the chip model increases, it is important to consider the specific design requirements of the application and to ensure that the chip model is properly configured and integrated into the system.
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5,153 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $377.4522 | $377.4522 |
| 10+ | $373.3936 | $3,733.9359 |
| 100+ | $353.1005 | $35,310.0462 |
| 1000+ | $332.8073 | $166,403.6660 |
| 10000+ | $304.3970 | $304,396.9500 |
| The price is for reference only, please refer to the actual quotation! | ||