
AMD Xilinx
XC3042-70PC84I
XC3042-70PC84I ECAD Model
XC3042-70PC84I Attributes
Type | Description | Select |
---|---|---|
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 5 V | |
Number of Inputs | 74 | |
Number of Outputs | 74 | |
Number of Logic Cells | 144 | |
Number of Equivalent Gates | 2000 | |
Number of CLBs | 144 | |
Combinatorial Delay of a CLB-Max | 9 ns | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | INDUSTRIAL | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 144 CLBS, 2000 GATES | |
Additional Feature | 480 FLIP-FLOPS; TYP. GATES = 2000-3000; POWER-DOWN SUPPLY CURRENT = 120UA | |
Clock Frequency-Max | 70 MHz | |
Power Supplies | 5 V | |
Supply Voltage-Max | 5.5 V | |
Supply Voltage-Min | 4.5 V | |
JESD-30 Code | S-PQCC-J84 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Peak Reflow Temperature (Cel) | 225 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 84 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | QCCJ | |
Package Equivalence Code | LDCC84,1.2SQ | |
Package Shape | SQUARE | |
Package Style | CHIP CARRIER | |
Surface Mount | YES | |
Terminal Finish | Tin/Lead (Sn85Pb15) | |
Terminal Form | J BEND | |
Terminal Pitch | 1.27 mm | |
Terminal Position | QUAD | |
Width | 29.3116 mm | |
Length | 29.3116 mm | |
Seated Height-Max | 5.08 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | LCC | |
Package Description | PLASTIC, LCC-84 | |
Pin Count | 84 | |
Reach Compliance Code | unknown | |
HTS Code | 8542.39.00.01 |
XC3042-70PC84I Datasheet Download
XC3042-70PC84I Overview
The XC3042-70PC84I chip model is a powerful, versatile, and cost-effective solution for high-performance digital signal processing, embedded processing, and image processing applications. It is built on a Xilinx Virtex-4 FPGA platform and can be programmed with HDL (Hardware Description Language) for a wide range of applications.
The XC3042-70PC84I chip model is suitable for use in a variety of networks, including local area networks (LANs), wide area networks (WANs), and storage area networks (SANs). It can be used in intelligent scenarios such as machine learning, artificial intelligence (AI), and natural language processing (NLP). This chip model is also suitable for the era of fully intelligent systems, as it has the capability to process large amounts of data quickly and accurately.
In terms of product design and requirements, the XC3042-70PC84I chip model is designed to meet the needs of a wide range of applications. It has a wide range of features and parameters, such as a maximum clock frequency of 400 MHz, up to 4 million logic elements, and up to 6.4 million flip-flops. It is also designed to be highly reliable, with advanced error-detection and correction features.
Case studies of the XC3042-70PC84I chip model have been conducted in a variety of applications, such as machine vision, autonomous vehicles, and robotics. These case studies have demonstrated the chip model's ability to provide reliable and accurate results in a wide range of scenarios.
When using the XC3042-70PC84I chip model, it is important to understand the design requirements and the intended application. It is also important to consider the power consumption, heat dissipation, and other environmental factors that may affect the chip's performance. Additionally, it is important to ensure that the HDL programming is correct and that the design is optimized for the intended application.
In conclusion, the XC3042-70PC84I chip model is a powerful and versatile solution for a wide range of digital signal processing, embedded processing, and image processing applications. It is suitable for use in networks, intelligent scenarios, and fully intelligent systems. It is designed to meet the needs of a variety of applications and is highly reliable. However, it is important to understand the design requirements and the intended application before using the chip model, and to ensure that the HDL programming and design are optimized for the intended application.
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