AMD Xilinx
XC3042-70CQ100M
XC3042-70CQ100M ECAD Model
XC3042-70CQ100M Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 82 | |
| Number of Outputs | 82 | |
| Number of Logic Cells | 144 | |
| Number of Equivalent Gates | 4200 | |
| Number of CLBs | 144 | |
| Combinatorial Delay of a CLB-Max | 9 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | MILITARY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 144 CLBS, 4200 GATES | |
| Additional Feature | MAX 82 I/OS; 480 FLIP-FLOPS | |
| Clock Frequency-Max | 70 MHz | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.5 V | |
| Supply Voltage-Min | 4.5 V | |
| JESD-30 Code | S-CQFP-F100 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 1 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Number of Terminals | 100 | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | QFF | |
| Package Equivalence Code | QFL100,.7SQ,25 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | FLAT | |
| Terminal Pitch | 635 µm | |
| Terminal Position | QUAD | |
| Width | 17.272 mm | |
| Length | 17.272 mm | |
| Seated Height-Max | 3.683 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | QFF, QFL100,.7SQ,25 | |
| Pin Count | 100 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | 3A001.A.2.C |
XC3042-70CQ100M Datasheet Download
XC3042-70CQ100M Overview
The XC3042-70CQ100M chip model is the latest innovation in the semiconductor industry. It is a high-performance, low-power device designed to meet the needs of a wide range of applications. This model has many advantages, such as improved signal integrity, increased reliability, and greater flexibility. It is also designed to be compatible with a variety of operating systems and platforms.
The XC3042-70CQ100M chip model has been designed to meet the needs of a wide range of industries, including automotive, consumer electronics, medical, and industrial. It is expected that demand for this model will continue to grow in the future, as it is increasingly used in more advanced applications. Its design makes it suitable for use in high-end communication systems, including 5G and 6G networks.
The XC3042-70CQ100M chip model is also suitable for use in the development and popularization of future intelligent robots. Its low-power design makes it ideal for use in robotics applications, and its flexibility allows for easy integration with existing systems. It also has a high level of reliability, which makes it a great choice for use in robotic systems.
In order to effectively use the XC3042-70CQ100M chip model, technical talents with experience in semiconductor engineering and robotics are needed. This model is designed to be upgradeable, allowing for future improvements and enhancements. With the right technical expertise, the XC3042-70CQ100M chip model can be used to develop and popularize the next generation of intelligent robots.
In conclusion, the XC3042-70CQ100M chip model is a versatile and reliable device that can be used in a wide range of industries and applications. It is expected to be in high demand in the future, and its upgradeability makes it suitable for use in advanced communication systems and the development of future intelligent robots. Technical expertise is required to use this model effectively, but with the right skills, it can be used to create the next generation of robots.
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| QTY | Unit Price | Ext Price |
|---|---|---|
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