AMD Xilinx
XC3042-70CQ100B
XC3042-70CQ100B ECAD Model
XC3042-70CQ100B Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 82 | |
| Number of Outputs | 82 | |
| Number of Logic Cells | 144 | |
| Number of Equivalent Gates | 4200 | |
| Number of CLBs | 144 | |
| Combinatorial Delay of a CLB-Max | 9 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Screening Level | 38535Q/M;38534H;883B | |
| Temperature Grade | MILITARY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 144 CLBS, 4200 GATES | |
| Additional Feature | MAX 82 I/OS; 480 FLIP-FLOPS | |
| Clock Frequency-Max | 70 MHz | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.5 V | |
| Supply Voltage-Min | 4.5 V | |
| JESD-30 Code | S-CQFP-F100 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 1 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Number of Terminals | 100 | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | QFF | |
| Package Equivalence Code | QFL100,.7SQ,25 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | FLAT | |
| Terminal Pitch | 635 µm | |
| Terminal Position | QUAD | |
| Width | 17.272 mm | |
| Length | 17.272 mm | |
| Seated Height-Max | 3.683 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | QFF, QFL100,.7SQ,25 | |
| Pin Count | 100 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | 3A001.A.2.C |
XC3042-70CQ100B Datasheet Download
XC3042-70CQ100B Overview
The XC3042-70CQ100B chip model is a powerful tool for high-performance digital signal processing, embedded processing, and image processing. It is designed to be used with the HDL language, which is a hardware description language that allows users to create complex systems with a high level of accuracy and efficiency. The chip model offers a great deal of flexibility and scalability, making it an ideal choice for a variety of applications.
The XC3042-70CQ100B chip model offers a number of advantages that make it an attractive choice for many industries. It is cost-effective, reliable, and highly efficient, and it provides users with the ability to quickly and easily create complex systems. In addition, the chip model is capable of handling a large amount of data and can be used for a variety of tasks. This makes it an ideal choice for many businesses that need to process large amounts of data.
The demand for the XC3042-70CQ100B chip model is expected to increase in the future as the need for high-performance digital signal processing, embedded processing, and image processing grows. This demand will likely be driven by the need for more sophisticated systems that can handle large amounts of data and can be used for a variety of tasks. Additionally, the chip model's scalability and flexibility make it an ideal choice for businesses that need to quickly and easily create complex systems.
The XC3042-70CQ100B chip model can also be used in networks, allowing businesses to create more efficient and secure systems. It can be used to create intelligent systems that can quickly and accurately process large amounts of data. Additionally, it can be used to create intelligent systems that can be used in the era of fully intelligent systems, such as those that can be used for autonomous driving or robotics. This chip model can be used to create systems that are reliable, secure, and efficient, making them an ideal choice for businesses that need to quickly and easily create complex systems.
In conclusion, the XC3042-70CQ100B chip model is an ideal choice for businesses that need to quickly and easily create complex systems. It offers a great deal of flexibility and scalability, making it an ideal choice for a variety of applications. Additionally, it can be used in networks and can be used to create intelligent systems that can be used in the era of fully intelligent systems. The demand for the chip model is expected to increase in the future as the need for high-performance digital signal processing, embedded processing, and image processing grows.
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4,998 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $459.7614 | $459.7614 |
| 10+ | $454.8177 | $4,548.1773 |
| 100+ | $430.0994 | $43,009.9377 |
| 1000+ | $405.3810 | $202,690.5110 |
| 10000+ | $370.7753 | $370,775.3250 |
| The price is for reference only, please refer to the actual quotation! | ||