AMD Xilinx
XC3042-50PG132M
XC3042-50PG132M ECAD Model
XC3042-50PG132M Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 96 | |
| Number of Outputs | 96 | |
| Number of Logic Cells | 144 | |
| Number of Equivalent Gates | 2000 | |
| Number of CLBs | 144 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | MILITARY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 144 CLBS, 2000 GATES | |
| Additional Feature | 480 FLIP-FLOPS; TYP. GATES = 2000-3000; POWER-DOWN SUPPLY CURRENT = 120UA | |
| Clock Frequency-Max | 50 MHz | |
| Power Supplies | 5 V | |
| JESD-30 Code | S-CPGA-P132 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Number of Terminals | 132 | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | PGA | |
| Package Equivalence Code | PGA132,14X14 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | NO | |
| Terminal Form | PIN/PEG | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | PERPENDICULAR | |
| Width | 37.084 mm | |
| Length | 37.084 mm | |
| Seated Height-Max | 3.9116 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | PGA | |
| Package Description | PGA, PGA132,14X14 | |
| Pin Count | 132 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | 3A001.A.2.C |
XC3042-50PG132M Datasheet Download
XC3042-50PG132M Overview
The XC3042-50PG132M chip model is a revolutionary product in the semiconductor industry. It is designed and manufactured by a leading semiconductor manufacturer, and it has been widely used in many industries. The XC3042-50PG132M chip model has a number of advantages that make it a popular choice for many applications.
The XC3042-50PG132M chip model has a high level of integration, which allows for a wide range of applications. It is designed with a low power consumption and a high-speed processing rate. The chip model also has an embedded flash memory, which allows for high-speed data storage. Additionally, it has a low-noise operation and is highly reliable.
The XC3042-50PG132M chip model has been widely adopted in the telecommunications industry. It is used in a variety of applications, including mobile phones, base stations, and routers. The chip model is also used in industrial automation, automotive, and medical applications. It is also used in consumer electronics, such as digital cameras and gaming consoles.
In the future, the demand for the XC3042-50PG132M chip model is expected to increase. This is due to its versatility and the fact that it is a reliable and cost-effective solution for many applications. Additionally, as new technologies emerge, the chip model may be used in more advanced communication systems.
The original design intention of the XC3042-50PG132M chip model was to provide a reliable, cost-effective solution for a variety of applications. The chip model has been designed to be upgradable, which allows it to be used in more advanced communication systems. It is also designed to be compatible with a variety of technologies, which means that it can be used in a variety of environments.
Overall, the XC3042-50PG132M chip model is a reliable and cost-effective solution for many applications. It has a number of advantages, such as its high level of integration, low power consumption, and embedded flash memory. Additionally, it is designed to be upgradable and compatible with a variety of technologies. As such, the demand for the XC3042-50PG132M chip model is expected to increase in the future, and it may be used in more advanced communication systems.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||