AMD Xilinx
XC3042-50PG132I
XC3042-50PG132I ECAD Model
XC3042-50PG132I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 96 | |
| Number of Outputs | 96 | |
| Number of Logic Cells | 144 | |
| Number of Equivalent Gates | 4200 | |
| Number of CLBs | 144 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 144 CLBS, 4200 GATES | |
| Additional Feature | MAX 96 I/OS; 480 FLIP-FLOPS | |
| Clock Frequency-Max | 50 MHz | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.5 V | |
| Supply Voltage-Min | 4.5 V | |
| JESD-30 Code | S-CPGA-P132 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Number of Terminals | 132 | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | PGA | |
| Package Equivalence Code | PGA132,14X14 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | NO | |
| Terminal Form | PIN/PEG | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | PERPENDICULAR | |
| Width | 37.084 mm | |
| Length | 37.084 mm | |
| Seated Height-Max | 4.318 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | PGA | |
| Package Description | PGA, PGA132,14X14 | |
| Pin Count | 132 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 |
XC3042-50PG132I Datasheet Download
XC3042-50PG132I Overview
The XC3042-50PG132I chip model is a cutting-edge technology that has been designed to meet the needs of the modern world. It is a high-performance, low-power, and highly efficient integrated circuit that has been designed to provide a wide range of services, from data processing to communications. It is capable of handling a variety of tasks, from basic operations to complex calculations.
The chip model XC3042-50PG132I has a number of advantages over other chip models. It is designed to be highly efficient, allowing it to perform more tasks in a shorter amount of time. It is also designed to be low-power, meaning it consumes less energy than other chip models. Additionally, it is designed to be highly reliable, meaning it can handle a variety of tasks without experiencing any problems.
The chip model XC3042-50PG132I is expected to be in high demand in the future. This is due to its ability to provide a wide range of services, from data processing to communications. Additionally, its low-power consumption and high efficiency make it ideal for use in a variety of applications, such as embedded systems, mobile devices, and communications systems.
The original design intention of the XC3042-50PG132I chip model was to provide a reliable and efficient solution for a variety of applications. The chip model was designed to be highly reliable and efficient, allowing it to handle a variety of tasks without experiencing any problems. Additionally, the chip model was designed to be low-power, meaning it consumes less energy than other chip models.
The XC3042-50PG132I chip model is capable of being upgraded in the future. This includes the possibility of adding new features and capabilities to the chip model. Additionally, the chip model can be used in advanced communication systems, such as 5G networks, which require more powerful and efficient chips.
In conclusion, the XC3042-50PG132I chip model is a cutting-edge technology that has been designed to meet the needs of the modern world. It is highly reliable, efficient, and low-power, making it ideal for use in a variety of applications. Additionally, it is capable of being upgraded in the future, making it suitable for use in advanced communication systems. Therefore, it is expected to be in high demand in the future, making it an attractive option for businesses and individuals.
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| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||