AMD Xilinx
XC3042-50PG132B
XC3042-50PG132B ECAD Model
XC3042-50PG132B Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 96 | |
| Number of Outputs | 96 | |
| Number of Logic Cells | 144 | |
| Number of Equivalent Gates | 2000 | |
| Number of CLBs | 144 | |
| Combinatorial Delay of a CLB-Max | 14 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Screening Level | MIL-STD-883 Class B | |
| Temperature Grade | MILITARY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 144 CLBS, 2000 GATES | |
| Additional Feature | 480 FLIP-FLOPS; TYP. GATES = 2000-3000; POWER-DOWN SUPPLY CURRENT = 120UA | |
| Clock Frequency-Max | 50 MHz | |
| Power Supplies | 5 V | |
| JESD-30 Code | S-CPGA-P132 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Number of Terminals | 132 | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | PGA | |
| Package Equivalence Code | PGA132,14X14 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | NO | |
| Terminal Form | PIN/PEG | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | PERPENDICULAR | |
| Width | 37.084 mm | |
| Length | 37.084 mm | |
| Seated Height-Max | 4.318 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | PGA | |
| Package Description | PGA, PGA132,14X14 | |
| Pin Count | 132 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A001.A.2.C | |
| HTS Code | 8542.39.00.01 |
XC3042-50PG132B Datasheet Download
XC3042-50PG132B Overview
Chip model XC3042-50PG132B is a highly advanced chip designed for specific applications. It is a member of the XC3042 family of chips, which are designed to provide a wide range of features, including high-performance processors, high-speed memory interfaces, and low-power consumption. The chip is specifically designed for communication systems and can be used in a wide range of applications including wireless communication, industrial automation, and medical devices.
The original design intention of the XC3042-50PG132B chip was to provide a high-performance, low-power solution for communication system applications. The chip can support a wide range of communication protocols, including Wi-Fi, Bluetooth, and Zigbee. It also supports a variety of data transfer protocols, such as USB, Ethernet, and Serial ATA. Furthermore, the chip has high-speed memory interfaces, allowing for fast data transfer rates and low latency.
The chip model XC3042-50PG132B can be used in a variety of applications and can be easily integrated into existing systems. It is designed to be flexible and can be used in a wide range of communication systems, including wireless, wired, and optical systems. Furthermore, the chip can be used in industrial automation and medical devices, allowing for the development of more advanced systems.
In terms of future upgrades, the XC3042-50PG132B chip can be upgraded to support new technologies and applications. For example, it can be upgraded to support more advanced communication protocols, such as 5G and Wi-Fi 6. Additionally, it can be upgraded to support new data transfer protocols, such as USB 3.2 and Ethernet 10G. Furthermore, the chip can be upgraded to support more advanced memory interfaces, allowing for faster data transfer rates and lower latency.
When using the XC3042-50PG132B chip, it is important to consider the specific design requirements of the application. The chip is designed to be flexible and can be used in a wide range of applications, but it is important to consider the specific requirements of the application before using the chip. Additionally, it is important to consider the environment in which the chip will be used, as this can affect the performance of the chip. Furthermore, it is important to consider the power consumption of the chip and the cooling requirements, as this can affect the overall performance of the system.
In conclusion, the XC3042-50PG132B is a highly advanced chip designed for specific applications. It is designed to provide a high-performance, low-power solution for communication system applications and can be easily integrated into existing systems. It can be upgraded to support new technologies and applications, and it is important to consider the specific design requirements of the application before using the chip. Additionally, it is important to consider the environment in which the chip will be used, as this can affect the performance of the chip.
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|---|---|---|
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