AMD Xilinx
XC3042-100PG132C
XC3042-100PG132C ECAD Model
XC3042-100PG132C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 96 | |
| Number of Outputs | 96 | |
| Number of Logic Cells | 144 | |
| Number of Equivalent Gates | 2000 | |
| Number of CLBs | 144 | |
| Combinatorial Delay of a CLB-Max | 7 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 144 CLBS, 2000 GATES | |
| Additional Feature | 480 FLIP-FLOPS; TYP. GATES = 2000-3000; POWER-DOWN SUPPLY CURRENT = 120UA | |
| Clock Frequency-Max | 100 MHz | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.25 V | |
| Supply Voltage-Min | 4.75 V | |
| JESD-30 Code | S-CPGA-P132 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 85 °C | |
| Number of Terminals | 132 | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | PGA | |
| Package Equivalence Code | PGA132,14X14 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | NO | |
| Terminal Form | PIN/PEG | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | PERPENDICULAR | |
| Width | 37.084 mm | |
| Length | 37.084 mm | |
| Seated Height-Max | 3.9116 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | PGA | |
| Package Description | PGA, PGA132,14X14 | |
| Pin Count | 132 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 |
XC3042-100PG132C Datasheet Download
XC3042-100PG132C Overview
The XC3042-100PG132C chip model is a significant development in the chip industry and has become one of the most sought-after models in the world. It is a powerful and reliable chip that can be used in various industries and applications. It has a wide range of applications, including communication systems, intelligent robots, and other related industries.
The XC3042-100PG132C chip model has been designed for maximum performance and reliability. It is equipped with advanced features that provide the highest level of performance and reliability. It is capable of handling large amounts of data and can be used in various environments. It is also designed to be compatible with the latest technologies, allowing for easy integration into existing systems.
In terms of industry trends, the XC3042-100PG132C chip model is expected to continue to be popular in the future. It is likely to remain one of the most sought-after models in the chip industry due to its performance, reliability, and compatibility with the latest technologies. The chip model is also expected to be used in the development and popularization of future intelligent robots, as it is capable of handling large amounts of data and can be used in various environments.
In terms of future upgrades, the XC3042-100PG132C chip model is expected to be able to keep up with the latest technologies. The chip model is designed to be compatible with the latest technologies, allowing for easy integration into existing systems. It is also expected to be able to support new technologies, depending on the specific technologies that are needed.
In order to effectively use the XC3042-100PG132C chip model, it is important for technical professionals to understand the chip model and its capabilities. It is important to understand the original design intention of the chip model and the potential for future upgrades. It is also important to understand the application environment and the specific technologies that are needed. Technical professionals should also be aware of the industry trends and the potential for the chip model to be used in the development and popularization of future intelligent robots. With the right knowledge and expertise, the XC3042-100PG132C chip model can be used to its full potential.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||