XC3042-100CB100M
XC3042-100CB100M
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rohs

AMD Xilinx

XC3042-100CB100M


XC3042-100CB100M
F20-XC3042-100CB100M
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, GQFF, TPAK100,2.6SQ,25
GQFF, TPAK100,2.6SQ,25

XC3042-100CB100M ECAD Model


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XC3042-100CB100M Attributes


Type Description Select
Rohs Code No
Part Life Cycle Code Obsolete
Supply Voltage-Nom 5 V
Number of Inputs 82
Number of Outputs 82
Number of Logic Cells 144
Number of Equivalent Gates 2000
Number of CLBs 144
Combinatorial Delay of a CLB-Max 7 ns
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade MILITARY
Package Shape SQUARE
Technology CMOS
Organization 144 CLBS, 2000 GATES
Additional Feature 480 FLIP-FLOPS; TYP. GATES = 2000-3000; POWER-DOWN SUPPLY CURRENT = 120UA
Clock Frequency-Max 100 MHz
Power Supplies 5 V
JESD-30 Code S-CQFP-F100
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 1
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Number of Terminals 100
Package Body Material CERAMIC, METAL-SEALED COFIRED
Package Code GQFF
Package Equivalence Code TPAK100,2.6SQ,25
Package Shape SQUARE
Package Style FLATPACK, GUARD RING
Surface Mount YES
Terminal Finish TIN LEAD
Terminal Form FLAT
Terminal Pitch 650 µm
Terminal Position QUAD
Width 19.05 mm
Length 19.05 mm
Seated Height-Max 2.921 mm
Ihs Manufacturer XILINX INC
Part Package Code QFP
Package Description GQFF, TPAK100,2.6SQ,25
Pin Count 100
Reach Compliance Code unknown
HTS Code 8542.39.00.01
ECCN Code 3A001.A.2.C

XC3042-100CB100M Datasheet Download


XC3042-100CB100M Overview



The XC3042-100CB100M chip model is a powerful digital signal processor, embedded processor, and image processor, which is suitable for high-performance applications. It is designed to be programmed in HDL language, which is a hardware description language that allows engineers to design, simulate, and synthesize digital circuits.


The industry trends of the XC3042-100CB100M chip model and the future development of related industries largely depend on the specific technologies that are needed. As the demand for more powerful processors and image processors increases, the XC3042-100CB100M chip model will be able to meet the needs of the market. It is likely that the chip model will be used in the future in networks and intelligent scenarios, as it is capable of processing large amounts of data quickly and accurately.


The XC3042-100CB100M chip model is also well-suited for use in the era of fully intelligent systems. Its high-performance capabilities and ability to process data quickly make it ideal for use in artificial intelligence applications. It is also capable of handling complex tasks, such as facial recognition, natural language processing, and image recognition. As the demand for more powerful and intelligent systems increases, the XC3042-100CB100M chip model will be able to meet the needs of the market.


In conclusion, the XC3042-100CB100M chip model is a powerful digital signal processor, embedded processor, and image processor, which is suitable for high-performance applications. It is designed to be programmed in HDL language, which is a hardware description language that allows engineers to design, simulate, and synthesize digital circuits. The industry trends of the XC3042-100CB100M chip model and the future development of related industries largely depend on the specific technologies that are needed. As the demand for more powerful processors and image processors increases, the XC3042-100CB100M chip model will be able to meet the needs of the market. It is likely that the chip model will be used in the future in networks and intelligent scenarios, as well as in the era of fully intelligent systems.



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Unit Price: $28.00
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Pricing (USD)

QTY Unit Price Ext Price
1+ $26.0400 $26.0400
10+ $25.7600 $257.6000
100+ $24.3600 $2,436.0000
1000+ $22.9600 $11,480.0000
10000+ $21.0000 $21,000.0000
The price is for reference only, please refer to the actual quotation!

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