AMD Xilinx
XC3030L-8VQ100I
XC3030L-8VQ100I ECAD Model
XC3030L-8VQ100I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 3.3 V | |
| Number of Inputs | 80 | |
| Number of Outputs | 80 | |
| Number of Logic Cells | 100 | |
| Number of Equivalent Gates | 1500 | |
| Number of CLBs | 100 | |
| Combinatorial Delay of a CLB-Max | 6.7 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 100 CLBS, 1500 GATES | |
| Additional Feature | MAX USABLE 2000 LOGIC GATES | |
| Clock Frequency-Max | 80 MHz | |
| Power Supplies | 3.3 V | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3 V | |
| JESD-30 Code | S-PQFP-G100 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 240 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 100 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFQFP | |
| Package Equivalence Code | TQFP100,.63SQ | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, THIN PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 14 mm | |
| Length | 14 mm | |
| Seated Height-Max | 1.2 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | PLASTIC, VQFP-100 | |
| Pin Count | 100 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC3030L-8VQ100I Datasheet Download
XC3030L-8VQ100I Overview
The chip model XC3030L-8VQ100I is a highly integrated, low-power, field-programmable gate array (FPGA) designed for a wide range of applications. It is a product of Xilinx, a world-leading provider of programmable logic solutions. The device integrates a rich set of features and functions, including 8-bit microprocessor support, up to 8K logic cells, and up to 256K bits of embedded memory. It also offers a wide range of I/O options, including LVDS, USB, and Ethernet.
The XC3030L-8VQ100I chip model is designed to meet the demands of a variety of applications. It is suitable for use in industrial, automotive, medical, and communications systems, as well as in consumer electronics and other applications. Its flexibility and scalability make it suitable for a wide range of applications, from low-end to high-end. It is also well-suited for applications that require high performance and low power consumption.
The XC3030L-8VQ100I chip model is designed to be highly reliable and is expected to have a long product life cycle. It is also designed to be upgradeable and can be easily adapted for new technologies. This makes it an ideal choice for applications that require support for new technologies. It is also suitable for use in advanced communication systems, such as those used in the military, aerospace, and telecommunications industries.
The XC3030L-8VQ100I chip model is expected to have a strong demand in the future, as its features and functions make it suitable for a wide range of applications. Its flexibility and scalability make it suitable for use in low-end to high-end applications. Its upgradeability and support for new technologies make it suitable for use in advanced communication systems. This makes it an ideal choice for those looking for a chip model that is reliable, cost-effective, and can be easily adapted to new technologies.
You May Also Be Interested In
5,649 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $8.9280 | $8.9280 |
| 10+ | $8.8320 | $88.3200 |
| 100+ | $8.3520 | $835.2000 |
| 1000+ | $7.8720 | $3,936.0000 |
| 10000+ | $7.2000 | $7,200.0000 |
| The price is for reference only, please refer to the actual quotation! | ||