AMD Xilinx
XC3030L-8VQ100C
XC3030L-8VQ100C ECAD Model
XC3030L-8VQ100C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 3.3 V | |
| Number of Inputs | 80 | |
| Number of Outputs | 80 | |
| Number of Logic Cells | 100 | |
| Number of Equivalent Gates | 1500 | |
| Number of CLBs | 100 | |
| Combinatorial Delay of a CLB-Max | 6.7 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 100 CLBS, 1500 GATES | |
| Additional Feature | MAX USABLE 2000 LOGIC GATES | |
| Clock Frequency-Max | 80 MHz | |
| Power Supplies | 3.3 V | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3 V | |
| JESD-30 Code | S-PQFP-G100 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 240 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 100 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFQFP | |
| Package Equivalence Code | TQFP100,.63SQ | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, THIN PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 14 mm | |
| Length | 14 mm | |
| Seated Height-Max | 1.2 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | PLASTIC, VQFP-100 | |
| Pin Count | 100 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC3030L-8VQ100C Datasheet Download
XC3030L-8VQ100C Overview
The chip model XC3030L-8VQ100C is a high-performance digital signal processing device that is suitable for embedded processing, image processing, and other applications. It is designed to be used with HDL language, which is a hardware description language used to create digital systems. The original design intention of the chip model XC3030L-8VQ100C was to provide a reliable and powerful platform for digital signal processing and embedded processing. It is designed to be easily upgradable and can be used to develop advanced communication systems.
The chip model XC3030L-8VQ100C can be applied to various network scenarios, including the Internet of Things (IoT), 5G networks, and beyond. It is also capable of powering intelligent applications such as facial recognition, natural language processing, and other AI-related tasks. With its powerful processing capabilities, it can be used to create smart and efficient systems that can be used in the era of fully intelligent systems.
In addition, the chip model XC3030L-8VQ100C is designed with scalability in mind, so it can be upgraded or modified to meet the demands of the current market. It can be used to create high-performance systems, with the ability to process large amounts of data quickly and efficiently. This makes it an ideal choice for applications that require high performance and reliability.
The chip model XC3030L-8VQ100C is a powerful and reliable digital signal processing device that can be applied to various scenarios. It is designed to be used with HDL language and can be upgraded or modified to meet the demands of the current market. It is capable of powering intelligent applications, and can be used to create smart and efficient systems for the era of fully intelligent systems. With its powerful processing capabilities, it can be used to process large amounts of data quickly and efficiently, making it an ideal choice for applications that require high performance and reliability.
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3,032 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $15.0881 | $15.0881 |
| 10+ | $14.9259 | $149.2590 |
| 100+ | $14.1147 | $1,411.4706 |
| 1000+ | $13.3035 | $6,651.7580 |
| 10000+ | $12.1679 | $12,167.8500 |
| The price is for reference only, please refer to the actual quotation! | ||