AMD Xilinx
XC3030A-6VQ64C
XC3030A-6VQ64C ECAD Model
XC3030A-6VQ64C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 54 | |
| Number of Outputs | 54 | |
| Number of Logic Cells | 100 | |
| Number of Equivalent Gates | 1500 | |
| Number of CLBs | 100 | |
| Combinatorial Delay of a CLB-Max | 4.1 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 100 CLBS, 1500 GATES | |
| Additional Feature | MAX USABLE 2000 LOGIC GATES | |
| Clock Frequency-Max | 135 MHz | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.25 V | |
| Supply Voltage-Min | 4.75 V | |
| JESD-30 Code | S-PQFP-G64 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 240 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 64 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFQFP | |
| Package Equivalence Code | TQFP64,.47SQ | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, THIN PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 10 mm | |
| Length | 10 mm | |
| Seated Height-Max | 1.2 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | PLASTIC, VQFP-64 | |
| Pin Count | 64 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC3030A-6VQ64C Datasheet Download
XC3030A-6VQ64C Overview
The XC3030A-6VQ64C chip model is an advanced integrated circuit designed for high-performance digital signal processing, embedded processing, image processing, and other applications. It is a powerful and versatile tool that can be used in a wide range of applications, from consumer electronics to industrial automation. The chip model is programmed using the HDL (Hardware Description Language) language, and its features and capabilities are tailored to meet the specific needs of the application.
The XC3030A-6VQ64C chip model is designed to meet the needs of the current technology landscape. Its design incorporates the latest technologies and trends, allowing it to be used in a variety of applications. It is also capable of being upgraded to meet the demands of new technologies and trends. This chip model is an ideal choice for applications that require high-performance digital signal processing, embedded processing, image processing, and other related tasks.
The original design intention of the XC3030A-6VQ64C chip model was to provide a high-performance integrated circuit that could be used in a variety of applications. It was designed to be flexible and expandable, allowing it to be used in a wide range of applications. It has the potential to be upgraded and adapted to meet the needs of new technologies and trends. This chip model is also suitable for advanced communication systems, as it is designed to handle the requirements of high-speed data transmission and processing.
In conclusion, the XC3030A-6VQ64C chip model is a powerful and versatile integrated circuit that is suitable for a wide range of applications. It is designed to meet the needs of the current technology landscape and is capable of being upgraded to meet the demands of new technologies and trends. The chip model is also suitable for advanced communication systems, as it is designed to handle the requirements of high-speed data transmission and processing.
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5,397 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $12.3802 | $12.3802 |
| 10+ | $12.2470 | $122.4704 |
| 100+ | $11.5814 | $1,158.1440 |
| 1000+ | $10.9158 | $5,457.9200 |
| 10000+ | $9.9840 | $9,984.0000 |
| The price is for reference only, please refer to the actual quotation! | ||