
AMD Xilinx
XC3030A-6PQG100C
XC3030A-6PQG100C ECAD Model
XC3030A-6PQG100C Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 5 V | |
Number of Equivalent Gates | 1500 | |
Number of CLBs | 100 | |
Combinatorial Delay of a CLB-Max | 4.1 ns | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | RECTANGULAR | |
Technology | CMOS | |
Organization | 100 CLBS, 1500 GATES | |
Additional Feature | MAX USABLE 2000 LOGIC GATES | |
Clock Frequency-Max | 135 MHz | |
Supply Voltage-Max | 5.25 V | |
Supply Voltage-Min | 4.75 V | |
JESD-30 Code | R-PQFP-G100 | |
JESD-609 Code | e3 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 85 °C | |
Peak Reflow Temperature (Cel) | 245 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 100 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | QFP | |
Package Shape | RECTANGULAR | |
Package Style | FLATPACK | |
Surface Mount | YES | |
Terminal Finish | MATTE TIN | |
Terminal Form | GULL WING | |
Terminal Pitch | 650 µm | |
Terminal Position | QUAD | |
Width | 14 mm | |
Length | 20 mm | |
Seated Height-Max | 3.4 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | QFP | |
Package Description | QFP, | |
Pin Count | 100 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
XC3030A-6PQG100C Datasheet Download
XC3030A-6PQG100C Overview
The XC3030A-6PQG100C chip model is a high-performance integrated circuit that is designed for a wide range of applications. It is a highly integrated chip with various functions, such as providing high-speed data transmission, low power consumption, and high-quality images. It also has the ability to support multiple interfaces and protocols, which makes it suitable for different types of products.
The XC3030A-6PQG100C chip model has many advantages over other chip models. It has a high data transmission rate, low power consumption, and high-quality image processing capabilities. It can also support multiple interfaces and protocols, making it ideal for various types of products. Additionally, the chip model is highly reliable and has a long life span.
The demand for the XC3030A-6PQG100C chip model is expected to increase in the future due to the increasing need for high-performance integrated circuits in various industries. The chip model is widely used in the automotive, home appliance, and industrial automation industries, and its demand is expected to continue to grow in these areas. It is also expected to be used in the development of intelligent robots in the future, as it has the capability to support multiple interfaces and protocols.
In order to use the XC3030A-6PQG100C chip model effectively, a certain level of technical expertise is required. This includes knowledge of computer hardware, software, and digital signal processing. Additionally, knowledge of the chip model's specific design requirements and actual case studies is necessary in order to ensure that the model is used correctly.
Overall, the XC3030A-6PQG100C chip model has many advantages and is expected to be in high demand in the future. It is highly reliable and has a long life span, and it can support multiple interfaces and protocols, making it ideal for various types of products. It is also expected to be used in the development of intelligent robots in the future, and technical expertise is required in order to use the model effectively.
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